Mike Murray

A couple of friends, Al Uszynski and Eric Pollack, bright minds of the #LightingIndustry, have come together to discuss an important topic. #NonCompetes have been debated and thoroughly argued as a result of a new rule issued by the #FederalTradeCommission. But to explore how this works in the real world, here are 5 Big Questions from Inside Lighting on The End of Non-Competes. Shout out to Eric, Al, and all other professionals who make this industry a joy to collaborate within! #LightingSolutions #LED #LEDLighting #LEDDrivers #MagnitudeLighting

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When revenue and profitability don't follow investments fast enough. however there is no short cut in 3rd generation of Semi Conductors. the facts are they last 30y+ Wolfspeed has been leading the transition. at all steps of the supply starting from Materials, and it wouldn t be fair to treat them as a speculative asset ...! yet they need to generate revenue faster https://lnkd.in/giznB2n5

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On June 25, Aamir Paul, President of North America Operations, will speak at the 2024 #SelectUSASummit! 🌟During his panel discussion, "Selecting the USA: Again and Again," he'll discuss how U.S. manufacturing investments offer international companies the opportunity to reach their efficiency, reliability, #sustainability, and workforce goals. Learn more about the event here: http://spr.ly/6042ggpV0

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#HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total #DRAM Value, Says TrendForce Corporation 💡 Avril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI #chips. HBM's unit sales price is several times higher than that of conventional DRAM and about five times that of #DDR5. This pricing, combined with product iterations in AI #chip #technology that increase single-device HBM capacity, is expected to dramatically raise HBM’s share in both the capacity and market value of the DRAM market from 2023 to 2025. Specifically, HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025. A big thank you again to Avril Wu and TrendForce 集邦科技 for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/eDC9_Z7u #semiconductorindustry #semiconductors #semiconductor #tech #micron #skhynix #samsung #foundry #innovation #ai #nvidia #tsmc #server #it #ic

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When working with a PCBA supplier, communication is key. For your supplier to meet your needs, it's crucial that they understand your project's design goals and specifications, and can easily reach out to you. By choosing a reliable supplier and communicating effectively, you should have no problem achieving your desired end result. Here are some helpful tips and suggestions for improving communication with your PCBA supplier.

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Looking for insight on market fluctuations for electronic components? Check out the article below on leveraging historical pricing & availability trend data:

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In addition to the increased #export #restrictions on 23 #cutting-edge #semiconductor #manufacturing technologies in 2023, rumors suggest that further tightening on 4 additional #semiconductor or quantum computing-related technologies is on the horizon! Notably, besides #China, this move may further impact its major trading partners, including #SouthKorea, #Singapore, & #Taiwan.

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There is no doubt about it — the electronics manufacturing is not exempt from the impact of rising global interest rates. ​ ​ In fact, I recently read in IPC’s February 2024 Global Sentiment of the Electronics Supply Chain Report that 66% of electronics manufacturers are experiencing rising labour costs, and 44% report rising material costs. ​ ​ Although it appears that recruitment struggles, order backlogs and profit margins are currently declining, the economic recession could change that over the next six months. So, manufacturing companies that want to stay ahead must consider their supply chain strategies in these turbulent times...​ ​ Read the full report below.​ ​ #ElectronicsManfacturing #SupplyChain #ManufacturingSupplyChain​ ​ https://lnkd.in/eaWx3JGX

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Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab To say that the global #foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by #AI and #HPC applications is unprecedented, and with Intel Corporation joining the contract #chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that Rapidus Corporation, a foundry #startup backed by the #Japanese government and several major Japanese companies, is going to enter in 2027, when its first fab comes online, just a few years from now. In a fresh update on the status of bringing up the company's first leading-edge fab, Rapidus has revealed that they are intending to get in to the #chip packaging game as well. Once complete, the ¥5 trillion ($32 billion) fab will be offering both chip #lithography on a 2nm node, as well as packaging services for #chips produced within the facility – a notable distinction in an industry where, even if packaging isn't outsourced entirely (OSAT), it's still normally handled at dedicated facilities. Ultimately, while the company wants to serve the same clients as TSMC, Samsung Electronics, and Intel Corporation Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab. A big thank you again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejMkXkVQ #semiconductorindustry #semiconductormanufacturing #technology #it #tech #processor #aiot #ic #geopolitics #asml #automotiveindustry #ml #advancedpackaging #cpu #cloudcomputing #computer #hbm #memory

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Avnet continues to build momentum in the marketplace, climbing up six spots on this year’s Fortune 500 list of the largest U.S.-based businesses. With revenue of $26.5 billion in FY23, Avnet now ranks at No. 157. Previously ranked No. 163, this marks Avnet’s 45th year on the prestigious list. In total, Fortune 500 companies are two-thirds of the U.S. GDP, totaling $18.8 trillion (up 4%) in revenues, net income amounting to $1.7 trillion (up 10%), and market capitalization reaching $43.0 trillion, (up 30%), while the companies on the list employed 31 million people worldwide. Sign in to read more: https://lnkd.in/gAzeFNHe #Fortune500 #Fortune #Avnet

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Interesting findings out of Ernst & Young Global Consulting Services. Their report, covered in Manufacturing Digital, highlights AI’s increasing adoption in advanced manufacturing. At Flex, we’ve prioritized and deployed several practical uses of AI on the shop floor to optimize processes, enhance product quality, and drive efficiency. But for those just getting started, this article highlights several initiatives organizations and leaders can take to make manufacturing AI-ready. https://lnkd.in/gcnMkkw5 #Manufacturing #AI

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In honor of World Day for Cultural Diversity for Dialogue and Development, our Benchmark Inclusion Council released our first-ever company cookbook! This recipe collection celebrates our Benchmark family through the dishes we love. I’m excited to explore different cuisines from around the world and learn more about the cultures and backgrounds that enrich our team! Here's a preview of just a few of the over 180 recipes in the collection! There's definitely something for everyone to enjoy! #Benchmark #WhereYourWorkMatters #InclusionatBench

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Continuous improvement is a key part of an effective, sustained Lean culture and at the core of operational excellence. This IndustryWeek article delivers prescriptive advice and helpful reminders for any manufacturing leader, including tips around communication, feedback, engagement and more. #Manufacturing

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Happy #CostModelMonday! I did a #fan-out panel-level versus wafer-level comparison at #IMAPS DPC this year, and I'm expanding on it for the IMAPS Symposium. I had a single #yield chart in my analysis previously, looking at yield crossover points in relation to how expensive the incoming chip was. I did a new analysis that looks at when the crossover point occurs for two different panel sizes. In this chart, the same package is built with fan-out packaging on a 300mm wafer and from two different panel sizes. The yield for the 300mm wafer example is held steady at 99%, while the yield is changed for the panel-level processes. For the package built with the 515x510mm panel, the crossover point occurs just past 95%. However, the crossover point is closer to 94% for the package from the 600x600mm panel. In other words, a little more yield loss can be sustained by the package from the larger panel before it no longer competes with a higher yielding package from the wafer.

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What’s more innovative than #AI? The people behind it.   I recently sat down with Mark Kelly, Tom Grimes and Zari Venhaus to talk to our employees about AI at Eaton. We discussed how we’re using AI to impact the products we make and sell, how we design and manufacture those products and how we run and operate our company. And how at the heart of these big initiatives are our people. It’s our people who connect the business opportunity with the technology.   Through an AI steering committee, our employees are surfacing new AI use cases, capturing the scale of our collective intelligence to help move #Eaton forward. What’s more is that we’re educating our teams on AI grounded in ethics. This means we’re embracing new opportunities and upholding our core values by recognizing the right use cases for these tools.   By sharing their ideas, learning and adopting new technologies and intelligently applying them, our people will continue to drive innovation. #Innovation #DigitalTransformation

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Have you ever thought to yourself "How can I help make a contribution to making the world greener?" Register for our Paving the Green Path seminar and learn how YOUR orders (distributors), YOUR parts (suppliers) are making a difference one order/part at a time!

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#DDR3 Price Rebound Expected in the Upcoming Quarters, Benefiting #Taiwanese Manufacturers - check out at MEMPHIS Electronic for best options for your design in... 🤩 As the standard #DRAM market experiences an unprecedented cycle of supply-demand imbalance, the #shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading #manufacturers like #Samsung exiting DDR3 production, while demand for DDR3 from #AI and #edgecomputing devices continuing to increase, the storage capacity per single device is rising sharply. This is expected to drive a rebound in DDR3 prices, potentially benefiting related #Taiwanese manufacturers such as Winbond, Elite Semiconductor Microelectronics Technology (#ESMT), and Etron Technology Inc. 鈺創科技. In response to the shift of operational focus to high-bandwidth #memory (#HBM) and #DDR5, the world’s top three memory manufacturers are gradually phasing out the #DDR3 market. You can reach out to MEMPHIS Electronic the MEMORY COMPETENCE CENTER of the industry, to find alternatives that will fit your requirements and are also long term available. MEMPHIS Electronic - WE KNOW MEMORY A big thank you to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/dTG9kVbj Neumonda Intelligent Memory

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Exciting times ahead

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