Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab To say that the global #foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by #AI and #HPC applications is unprecedented, and with Intel Corporation joining the contract #chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that Rapidus Corporation, a foundry #startup backed by the #Japanese government and several major Japanese companies, is going to enter in 2027, when its first fab comes online, just a few years from now. In a fresh update on the status of bringing up the company's first leading-edge fab, Rapidus has revealed that they are intending to get in to the #chip packaging game as well. Once complete, the ¥5 trillion ($32 billion) fab will be offering both chip #lithography on a 2nm node, as well as packaging services for #chips produced within the facility – a notable distinction in an industry where, even if packaging isn't outsourced entirely (OSAT), it's still normally handled at dedicated facilities. Ultimately, while the company wants to serve the same clients as TSMC, Samsung Electronics, and Intel Corporation Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab. A big thank you again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejMkXkVQ #semiconductorindustry #semiconductormanufacturing #technology #it #tech #processor #aiot #ic #geopolitics #asml #automotiveindustry #ml #advancedpackaging #cpu #cloudcomputing #computer #hbm #memory
Japanese Govt decide to promote semicon now.... may be say again!!!
Future will tell! Very ambitious!
Senior Electrical Engineer at Lam Research
1moI am really curious where they put the exhaust pipes