#DDR3 Price Rebound Expected in the Upcoming Quarters, Benefiting #Taiwanese Manufacturers - check out at MEMPHIS Electronic for best options for your design in... 🤩 As the standard #DRAM market experiences an unprecedented cycle of supply-demand imbalance, the #shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading #manufacturers like #Samsung exiting DDR3 production, while demand for DDR3 from #AI and #edgecomputing devices continuing to increase, the storage capacity per single device is rising sharply. This is expected to drive a rebound in DDR3 prices, potentially benefiting related #Taiwanese manufacturers such as Winbond, Elite Semiconductor Microelectronics Technology (#ESMT), and Etron Technology Inc. 鈺創科技. In response to the shift of operational focus to high-bandwidth #memory (#HBM) and #DDR5, the world’s top three memory manufacturers are gradually phasing out the #DDR3 market. You can reach out to MEMPHIS Electronic the MEMORY COMPETENCE CENTER of the industry, to find alternatives that will fit your requirements and are also long term available. MEMPHIS Electronic - WE KNOW MEMORY A big thank you to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/dTG9kVbj Neumonda Intelligent Memory
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As per a report published in the #EconomicDailyNews, major #manufacturers such as #Samsung are ceasing to produce #DDR3, despite the growing need for #DDR3 in applications like #IoT & #Industrial / #Consumer. Consequently, the #storage #capacity of a single device is experiencing a fast increase. It is anticipated that this could lead to a rise in the price of #DDR3, which could be advantageous for associated #Taiwanese producers like #Winbond, #Nanya, #Etron, #鈺創科技, #ESMT. As a result of the #operational #focus shifting to high-bandwidth memory (#HBM) and #DDR5, the top three #memory #manufacturers globally are progressively exiting the #DDR3 market.
#DDR3 Price Rebound Expected in the Upcoming Quarters, Benefiting #Taiwanese Manufacturers - check out at MEMPHIS Electronic for best options for your design in... 🤩 As the standard #DRAM market experiences an unprecedented cycle of supply-demand imbalance, the #shortage of DDR3 production capacity has become even more severe. According to a report from the Economic Daily News, with leading #manufacturers like #Samsung exiting DDR3 production, while demand for DDR3 from #AI and #edgecomputing devices continuing to increase, the storage capacity per single device is rising sharply. This is expected to drive a rebound in DDR3 prices, potentially benefiting related #Taiwanese manufacturers such as Winbond, Elite Semiconductor Microelectronics Technology (#ESMT), and Etron Technology Inc. 鈺創科技. In response to the shift of operational focus to high-bandwidth #memory (#HBM) and #DDR5, the world’s top three memory manufacturers are gradually phasing out the #DDR3 market. You can reach out to MEMPHIS Electronic the MEMORY COMPETENCE CENTER of the industry, to find alternatives that will fit your requirements and are also long term available. MEMPHIS Electronic - WE KNOW MEMORY A big thank you to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/dTG9kVbj Neumonda Intelligent Memory
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🔍 Weekly Industry Highlights from Win Source (Week 2 of July 8-12) 🔍 Keep up with the latest developments in technology! Check out this week's key updates: - #USChipFunding: U.S. Chip Funding Supports Semiconductor Materials Industry. - #KyoceraAVX Introduces New Waterproof Connector. - #EDA Companies Collaborate with #Samsung to Enhance AI and 3D IC Technologies. - #TDK Launches Micronas HAL 302x Sensors. - #GlobalFoundries Acquires GaN IP from Tagore Technology. - #Anritsu Partners with Y.I.C. Technologies. - #Lattice Introduces MachXO5D-NX FPGAs. - #SIGLENT Releases New Programmable Linear DC Power Supplies. - #TaiwanElectronics: Taiwan's Pivotal Role in the Global Electronics Industry Strengthened. - #Kioxia Begins Mass Production of 218-Layer NAND Flash Products. Explore more on our blog 👉 https://lnkd.in/gH7rEdjy Stay ahead in tech with Win Source! #WINSOURCE #electronics #components #weeklydigest #industrynews #NANDflashmemory #DCPowerSupplies #SPD4000X #FPGA
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🔍🔬 Step into the World of Vertical and MEMS Probes Micro-Cutting for Semiconductors Testing Industry ⚡ In the fast-paced realm of electronics, precision is not just desirable – it's non-negotiable. As you navigate the intricate landscape of semiconductor testing, you know that achieving the perfect balance of contact force, current capacity, and pitch is paramount. That's where we come in. At Posalux, we're not just aware of your needs – we understand them. 🟢🟩 Let's Talk Vertical and MEMS Probes Micromachining: Imagine a world where every probe, every micron, matters. Your advanced probe cards, boasting thousands of vertical or MEMS probes, are your ticket to unlocking the true potential of memory and non-memory microprocessors on a wafer level. From DRAM to NAND to SoC, we've got you covered with our micromachining solutions. But it's not just about the technology – it's about understanding your world. 🔬 Experience High-Quality Vertical and MEMS Probes Micro-Cutting. Picture this: precision so fine, it's almost an art form. With our expertise, we slice through materials like copper, palladium, and iridium with unparalleled accuracy. Whether it's a cutting width of 20 µm or less or crafting probes of any length and shape, we're here to make your vision a reality. Your needs are our priority. Your challenges, our fuel. Ready to elevate your semiconductor testing game? Join us on this journey of precision, reliability, and innovation 🚀 Discover the Posalux difference today: https://buff.ly/3wP9Yx9 #PrecisionMicroMachining #SemiconductorTesting #VerticalProbes #MEMSProbes ProbesMicroCutting
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The #semiconductor advanced packaging market is expected to grow by $22.79 billion, with a compound annual growth rate of 8.72% from 2023 to 2028. The expansion of the market depends on several key factors, particularly advancements in semiconductor #IC design, innovations in #3D chip packaging, and the emergence of wafer-level packaging (#FO #WLP) technology. With the increasing demand for compact electronic devices, there is an urgent need for more sophisticated and efficient semiconductor solutions.
Forecast of Semiconductor Advanced Packaging Market from 2024 to 2028 📶 The semiconductor advanced packaging market is expected to grow by $22.79 billion, with a compound annual growth rate of 8.72% from 2023 to 2028. The expansion of the market depends on several key factors, particularly advancements in semiconductor IC design, innovations in 3D chip packaging, and the emergence of wafer-level packaging (FO WLP) technology. With the increasing demand for compact electronic devices, there is an urgent need for more sophisticated and efficient semiconductor solutions. These technologies enable manufacturers to develop smaller yet more powerful electronic products to meet the constantly evolving needs of consumers. As the industry continues to push the boundaries of semiconductor design and packaging, significant growth and innovation are expected in the market in the coming years. #semiconductor #advancedpackaging #semiconductorindustry #waferchem
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What's the difference between a semiconductor, microchip, and integrated circuit? Let Whistler Technology explain, read more here https://lnkd.in/eYjYWGJR Jonathan Vincent Steve Megson Philip Megson #semiconductors #microchips #integratedcircuits #technology #advice #explanation #guidance #supplychain
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As the world's reliance on smart devices grows, so does the demand for high-performance, low-cost semiconductor technologies. Learn more about how Teflon™ fluoropolymers can enhance semiconductor manufacturing and improve the connected world: https://chem.rs/4cHHPsn #Semiconductors #SemiconductorIndustry #Microchips
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#chipwar #semiconductor #chipmanufacturing #chipshortage #semiconductorindustry #economictimes #growthopportunities #indianeconomy #designengineers Why semiconductors are important? ■Semiconductors are electrical components used in many consumer and industrial products. ■They are a key part of our lives, and are used in everything from computers and phones to watches, cars, and LED lights. ■The global semiconductor market size was valued at $526.8 billion in 2023, which is an 8.2% decrease from 2022's total of $574.1 billion. ■However, the market is expected to increase by 13.1% in 2024. Some interesting data points about semiconductors market: Credits: Newspaper
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https://lnkd.in/gSDncJEc The U.S. Semiconductor Sector Is Surging, We Need the Workforce to Match. #unitedstates #workforce #Semiconductorindustry #electronics #semiconductor #supplychain #manufacturingtechnology #processtechnology #engineering #manufacturing #technology #computerchips #business #innovation #semiconductors #chips #chipmaker #foundry credit: barrons
The U.S. Semiconductor Sector Is Surging. We Need the Workforce to Match.
barrons.com
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【Industry news】 #AMD releases #MI325X #AI #chip: 30% faster than #NVIDIA #H200 and is #cooperating with #TSMC on #3nm #AMD Chairman and CEO Su Zifeng gave a speech at #COMPUTEX Taipei International Computer Show and released the latest AI chip: Instinct #MI325X, which is expected to be launched in the fourth quarter of 2024. Su Zifeng emphasized that the previously released #MI300 is #AMD's fastest-growing product. The new generation #MI325X is equipped with HBM3E high-bandwidth storage and adopts #CDNA3 architecture. In terms of performance, #MI325X will be equipped with up to 288GB HBM3E #storage, providing #6TB #bandwidth per second. Compared with NVIDIA H200, the #memory #capacity and bandwidth are nearly doubled, and the computing speed is 30% faster. Su Zifeng also announced that AMD will launch #MI350 in 2025, using a #3nm #process; #MI400 is expected to be launched in 2026, based on #AMD's #CDNA "Next" architecture, and is expected to be launched in 2026. Previously, there was news that #AMD will adopt #Samsung's #3nm #process. Su Zifeng said at COMPUTEX that #TSMC is #AMD's #partner and is very #powerful. Currently, the two parties have several #3nm #process #products to #cooperate with.
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Until May 2022: Memory Cell Design, Technical Lead @SEC July 2024 ~: 3D V-RAM and V-CMOS concept, patent, and structure development. *Freelancer
The critical limitations of sub-10nm DRAM shrinking are as follows ? Structural Stability Issue: At sub 10nm DRAM processes, the nanostructure(HAR issues..)of chips becomes less stable, leading to an increase in defect rates. Consequently, the decrease in yield and cost increase can outweigh the chip count increase due to shrinking.? Performance and Power Challenges: Shrinking to sub-10nm processes may result in limited performance improvements while increasing standby power consumption.? Coupling, Noise, and Reliability Problems: Sub 10nm processes can lead to increased coupling, noise, and reliability issues, negatively affecting customer preference and market competitiveness.? Rising Fixed Costs: The efficiency gains from shrinking in sub 10nm processes may not be sufficient to offset the rising fixed costs, making further shrinking less viable.?
It seems another supply-demand cycle comes.