Noam Rabin

Thunderbolt Share is a groundbreaking software solution that transforms PC-to-PC interactions. Available with select PCs featuring Thunderbolt 4 or Thunderbolt 5 ports, Thunderbolt™ Share offers responsive screen-sharing and swift file transfers, redefining productivity and flexibility in your workflows. Thunderbolt Share not only enhances the capabilities of Intel's products but also provides substantial benefits to #IntelPartners by improving their product offerings, customer satisfaction, productivity, market reach, and innovative leadership. This technology fosters a more connected and efficient environment, which is crucial in today's fast-paced digital landscape. By leveraging Thunderbolt Share, Intel's partners can significantly enhance their competitive edge and meet the evolving demands of their customers. https://lnkd.in/gDsAjzKR

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Join the talk to learn about how things are changing with HW acceleration for Presto !

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A very interesting blog by Giuseppe Piccolboni of Weebit Nano Ltd about the use of our #ReRAM for #neuromorphic applications

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In the fiercely competitive semiconductor industry, companies are in a constant battle to retain top talent because in the heart of every good engineer is a passionate problem solver, looking for their next challenge. For them, innovation is the currency of success. Yet companies like Qualcomm, Intel, and Broadcom attract tens of thousands every year by dangling lucrative compensation packages to lure them from competitors. Startup leaders don’t have those resources, so they have to work harder to attract the best talent and then fight like hell to retain them. But some of the most successful startup leaders I know take a different approach. Rather than viewing attraction and retention as a fight, they leverage the inherent qualities of their companies as their advantage. They use their nimbleness, bias toward innovation, and their collaborative cultures like superpowers to attract the right people and those usually end up being the reasons why people stay. Take Richard Fung, CEO of The Six Semiconductor, for example. I had a conversation with Richard and asked him to share his approach to motivating his team. His response was like a mini-masterclass on the topic of talent attraction and retention. Richard emphasized that a culture that encourages engineers to dive deep into the intricacies of their craft, understand the systems they’re building, and connect with the end customer is a successful culture. Richard has been using this approach and it's been paying dividends for The Six Semiconductor so in his honor, here are his six key concepts for creating this type of organization: 1. Foster a Learning Culture: Support ongoing learning and skill development beyond employees' core responsibilities. 2. Prioritize Customer Focus: Embed a customer-centric mindset, and encourage employees to enhance user experiences through their work. 3. Champion Problem-Solving: Empower employees to creatively solve challenges with a focus on customer needs. 4. Promote System-Level Understanding: Encourage employees to grasp the bigger picture of the company's offerings and their role within it. 5. Break Down Silos: Promote collaboration to ensure a comprehensive understanding of projects across teams. 6. Offer Meaningful Challenges: Provide intellectually stimulating projects that make a tangible impact on the company's success. What Richard highlighted is that success goes much deeper than getting great people to join. It's about unleashing the full potential of every individual on your team to drive innovation and help shape the company, and ensuring your team heads in the right direction together. I’m thrilled I got to learn Richard’s perspective and believe other leaders can benefit from hearing it, so I shared the video below. My "challenge question" to other startup leaders is this: what are you doing to foster this type of culture in your organization? Either share below or, feel free to DM me. #semiconductorindustry #startup #leadership

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8 Pioneers of the Semiconductor Industry: Shaping the Last 100 Years (Part 2) 1. Aart de Geus: Founder of Synopsys Aart de Geus is a pioneering figure in the field of electronic design automation (EDA). He co-founded Synopsys in 1986, a company that revolutionized the way semiconductors are designed. Synopsys introduced the concept of logic synthesis, automating the process of converting high-level design descriptions into gate-level implementations. 2. Alberto Sangiovanni-Vincentelli: Founder of Cadence Alberto Sangiovanni-Vincentelli co-founded Cadence Design Systems in 1988, another giant in the EDA industry. Cadence provides comprehensive software, hardware, and IP for designing integrated circuits, systems on chips (SoCs), and printed circuit boards (PCBs). 3. Bob Widlar: Analog Circuit Design Genius Bob Widlar was a legendary figure in analog circuit design. His innovative designs in the 1960s and 1970s set new standards for performance and integration in analog ICs. Widlar developed groundbreaking operational amplifiers, voltage regulators, and other analog circuits that became the foundation for many modern electronic devices. 4. Barry Gilbert: Inventor and Innovator Barry Gilbert is renowned for his work in analog and mixed-signal circuit design. He is best known for inventing the Gilbert cell. This key component is used in many analog multiplier and mixer circuits in communication systems. 5. John von Neumann: Computing Pioneer John von Neumann was a mathematician and physicist whose work laid the groundwork for modern computing. His conceptualization of the stored-program computer architecture, known as the von Neumann architecture. It is the foundation of virtually all modern computers. 6. Mohamed Atalla and Dawon Kahng: The MOSFET Innovators Mohamed Atalla and Dawon Kahng made groundbreaking contributions to semiconductor technology with the invention of MOSFET in 1959. The MOSFET became the building block of modern electronic devices due to its scalability, low power consumption, and high efficiency. 7. Frank Wanlass and Robert Dennard: CMOS and DRAM Pioneers Frank Wanlass is credited with the invention of CMOS technology in 1963, a key technology for building low-power, high-density integrated circuits. CMOS technology is ubiquitous in modern electronics, from microprocessors to memory devices. Robert Dennard’s invention of DRAM in 1967 revolutionized computer memory, providing high-density, low-cost storage solutions that have become a staple in computers and other digital devices. Dennard Scaling continued till 2000 along with moore's law. Add more people in the list (with why) A detailed post is in comments. For all semiconductor and AI related content, follow TechoVedas

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Great coverage by Anshel Sag in Forbes of our announcements during #CadenceLIVE , and especially appreciated his perspective of the role Cadence Design Systems is playing in the #semiconductor ecosystem, and the evolution we've been on for the past 5+ years to tackle system complexity with #AI, #digitaltwins and #accelleratedcompute. "[...] as computational problems grow, so does the scope of what Cadence must do. Cadence is becoming a systems solutions company, broadening the scope of the problems it solves. This reflects its recognition that the world is becoming increasingly complex and that systems approaches are the only way to solve the problems that arise from that level of complexity. Demand for semiconductor tools and system-level approaches will only increase as the world gets increasingly connected by semiconductors. With its AI-enhanced tools, Cadence is uniquely positioned to deliver those solutions." https://lnkd.in/gxSVkWCi

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Sahita Technologies is dedicated to empowering companies and nations to gain a competitive edge in the semiconductor and manufacturing sectors. Our comprehensive consulting services encompass: 🔧 Advanced Manufacturing ✅ Quality Assurance 🚚 Supply Chain Optimization 👩‍🏭 Workforce Development 🛠️ Framework Development 🎥 Semiconductor Workforce Documentary Join us in driving the smart manufacturing revolution! We specialize in creating robust semiconductor and manufacturing frameworks, strategic workforce solutions, and fostering vital industry-academic collaborations. 🤝 We're at the forefront of integrating technology and media to engage the next generation of students and professionals. 🚀 Join us in shaping the future of manufacturing and semiconductors! Together, we can drive innovation, excellence, and growth. Current engagements: ▪University of Texas at Dallas - Build workforce strategy for the North Texas Semiconductor Institute ▪Consult with research firms and investors on current needs and future trends ▪Partner: SRC Semiconductor Manufacturing and Advanced Research with Twins (SMART) USA Institute ▪Industry-Academia Collaborations: Fostering partnerships between educational institutions and the semiconductor industry. #Semiconductors #Manufacturing #WorkforceDevelopment #SmartManufacturing https://lnkd.in/gQvH3fwT

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Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab To say that the global #foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by #AI and #HPC applications is unprecedented, and with Intel Corporation joining the contract #chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that Rapidus Corporation, a foundry #startup backed by the #Japanese government and several major Japanese companies, is going to enter in 2027, when its first fab comes online, just a few years from now. In a fresh update on the status of bringing up the company's first leading-edge fab, Rapidus has revealed that they are intending to get in to the #chip packaging game as well. Once complete, the ¥5 trillion ($32 billion) fab will be offering both chip #lithography on a 2nm node, as well as packaging services for #chips produced within the facility – a notable distinction in an industry where, even if packaging isn't outsourced entirely (OSAT), it's still normally handled at dedicated facilities. Ultimately, while the company wants to serve the same clients as TSMC, Samsung Electronics, and Intel Corporation Foundry, the firm plans to do things almost completely differently than its competitors in a bid to speed up chipmaking from finishing design to getting a working chip out of the fab. A big thank you again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejMkXkVQ #semiconductorindustry #semiconductormanufacturing #technology #it #tech #processor #aiot #ic #geopolitics #asml #automotiveindustry #ml #advancedpackaging #cpu #cloudcomputing #computer #hbm #memory

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The global investor community has been captivated by the rise of AI, leading to a proliferation of AI startups in recent years. As of our latest count, there are around 200-210 hardware companies focused on AI applications worldwide. However, the challenge remains in distinguishing which of these companies will successfully commercialize their technology and which will remain "great ideas that never came to fruition." In my view, the key element determining success or failure is talent. Developing silicon is tough, and creating chips for AI-centric workloads is even tougher. AI hardware demands deep knowledge in mathematics, computer science, and electrical engineering. Companies often struggle to build teams with the right mix of hardware, software, algorithm, sales, and marketing skills to not only bring their products to life but also sell them to customers who may still be skeptical about AI transformation. This is why I’ve been impressed by the success of Canadian AI hardware startups like Tenstorrent and Untether AI. These companies have assembled world-class teams, developed industry-leading solutions, and successfully brought their chips to market. For years, I’ve believed that Canada is a "sleeping giant" in terms of having world-class talent that many in the global community underestimate. Tenstorrent and Untether AI are winning because they’ve harnessed the human capital available in cities like Toronto. This reminds me of a conversation I had with Hugh Chow, CEO of Canada’s premier startup accelerator ventureLAB when Hugh highlighted that Canada has long been a key player in AI development. Canadian Machine Learning expert Geoffrey Hinton’s seminal research laid much of the groundwork for the innovations we see today. Cities like Toronto have a unique mix of hardware and software talent and offer various career opportunities at startups and established companies, creating a virtuous cycle that attracts even more talent. Hugh and his team at ventureLAB are passionate about the potential of AI to transform sectors like medical tech, drones, education, and elder care which is why they work closely with startup founders such as Niraj Mathur, COO of Blumind, to help them secure the funding and talent needed to strengthen their companies. I encourage you to listen to Hugh’s perspective about why Canada is a formidable region for AI startups. Consider it an “appetizer” because tomorrow I’ll be broadcasting LIVE from ventureLAB’s headquarters in Toronto where you can hear the rest of Hugh’s insights as the “main course”. Check the event link in the comments and I hope to see you there! #semiconductorindustry #startups #artificialintelligence

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TSMC and Cadence are collaborating on next-generation #AI-driven flows, including the Cadence Cerebrus™ Intelligent Chip Explorer, for design productivity and optimization and Pegasus™ Verification System for Physical verification Signoff. #Cadence #Signoff #PhysicalVerification #Design #FoundryCertified “We have a distinguished track record collaborating with TSMC to deliver a broad set of innovations across EDA, packaging and IP to accelerate system and semiconductor design and enable customers to achieve aggressive time-to-market goals. These new certified design flows and standardized solutions allow customers to confidently design for TSMC advanced nodes and usher in improved design efficiency and technological advancements,” said Chin-Chi Teng, SVP and GM, R&D, Cadence. Read the press release here: https://ow.ly/bTym50REHjG

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Advanced Packaging Is Radically Reshaping the #Chip Ecosystem 💡 Periodically, analysts commenting on the chip industry will pronounce that Moore’s Law is obsolete. Yet while the speed of progress is slowing down, #chipmakers are still doubling the number of #transistors on an integrated circuit (#IC) approximately every 2.5 years. In the past, fundamentally new approaches for chip design never seemed to catch on. That’s no longer the case as fresh ideas that are essential for running some of today’s most important applications are rapidly gaining favor. One of the most significant of these new concepts is #advancedpackaging, which essentially accommodates an ever-increasing number of transistors by decreasing the size of electrical contacts. Traditionally, a #semiconductor chip focuses on performing one particular action or process. By comparison, an advanced multichip package incorporates multiple chips and processes into one component. This transformative approach integrates a multitude of semiconductor components into a single package, directly addressing the most critical semiconductor technical and commercial constraints. A very big thank you to my friend Dr. Karl Breidenbach and his colleagues Joseph Fitzgerald, Jan H. Mohr, Dr. Nadim Sah, Dr. Jörg Jeschke, Dr. Karl Breidenbach, Nicola Kerschbaumer,  Sohini Kar from Boston Consulting Group (BCG) for the full article with more background, charts and insights via the link below 💡🙏👇 https://lnkd.in/eVvUhbKf #semicondcutorindustry #semiconductors #semiconductor #chip #ic #technology #tech #chiplets #chiplet #foundry #innovation #icdesign #tsmc #samsung #intel #geopolitics #usa #taiwan #southkorea #it #ai

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Check out what we have to say now!

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PCIe Gen6 + 5nm + MRVL SerDes = Lowest Power for AI!!

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When adding stitching vias to a PCB, strategic placement is crucial. It's essential to position them around the edges of critical components, high-speed signal traces, and ground planes. This ensures effective shielding and enhanced signal integrity. The appropriate size and spacing of stitching vias are chosen based on your application's specific requirements and the PCB's material. #PCBdesign

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Micron Technology unveils QLC NAND #SSD with more than 200 layers 💡 #Micron has launched a 2500 QLC NAND internal fit client product that’s faster than its 2550 TLC predecessor, despite TLC #NAND typically being quicker than QLC NAND. TLC (triple level cell) NAND has 3 bits per cell while QLC (quad level cell) has 4 bits per cell, meaning the #SSD's controller has to negotiate QLC’s 16 voltage states per cell instead of 8 with TLC. It takes longer to read and write individual cells unless the controller #firmware gets clever with such things as a very fast SLC (1 bit/cell) cache, and parallel #data plane access. Micron’s 2500 is claimed to be the first 200-plus layer QLC drive for OEM #desktop and #notebook (client) #computers. It uses 232-layer QLC NAND, and this gives it 30 percent more density, Micron says, than its 2400 176-layer QLC product, and 31 percent more than its 232-layer TLC NAND, as used in the 2550 M.2 format SSD. This was launched in December 2022 so it has taken 16 months to add the extra bit to the 232-layer NAND cells used in the 2500. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eqDvqWmQ #semiconductor #semiconductorindustry #semiconductors #technology #tech #informationtechnology #chip #chips #it #computer #memory

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Stitching vias, also known as via stitching, are a crucial design practice for PCBs. By placing a series of vias around the perimeter of a ground plane or signal trace, a continuous conductive path is created, connecting the top and bottom layers of the board. #PCBdesign #viastitching

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Join this upcoming AMD w ebinar on June 26th: Designing for Versal Adaptive SoCs with AI Engines using Simulink and Vitis Model Composer. This webinar will show an example design – targeting the programmable logic and AI Engines in a Versal AI Edge device, and features speakers from AMD, Avnet, and MathWorks. #TogetherWeAdvance #AdaptiveComputing #Webinar #Versal #Vitis

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Devices that benefit most from LPDDR4X are those requiring efficient power management and high-speed data processing, such as smartphones, tablets, and other portable or embedded systems. Its low voltage operation and high data rates make it ideal for running advanced applications and handling demanding tasks.

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