TSMC and Cadence are collaborating on next-generation #AI-driven flows, including the Cadence Cerebrus™ Intelligent Chip Explorer, for design productivity and optimization and Pegasus™ Verification System for Physical verification Signoff. #Cadence #Signoff #PhysicalVerification #Design #FoundryCertified “We have a distinguished track record collaborating with TSMC to deliver a broad set of innovations across EDA, packaging and IP to accelerate system and semiconductor design and enable customers to achieve aggressive time-to-market goals. These new certified design flows and standardized solutions allow customers to confidently design for TSMC advanced nodes and usher in improved design efficiency and technological advancements,” said Chin-Chi Teng, SVP and GM, R&D, Cadence. Read the press release here: https://ow.ly/bTym50REHjG
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Join John Park, Cadence Product Director, at the Chiplets: Building the Future of SoCs virtual event on July 24 and 25 as we explore advancements in chiplet technology! He’ll be sharing insights on the role of EDA as chips transform into 3D systems. Don’t miss this chance to gain a competitive edge in the evolving chiplet landscape! Register now. https://ow.ly/BiLA50SABLt #Cadence #3DIC #Chiplet #EDA
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Cadence Pegasus Verification System Have you ever wanted to write a DRC rule deck to check for space or width constraints on polygons? Or have you wondered how the multiple lines of an LVS rule deck extract and conduct a comparison between the schematic and layout? Read this blog to learn more. #Pegasus #Cadence #PhysicalVerification #DigitalDesign #Signoff https://ow.ly/9vCi50SxsS6
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Learn all about Pegasus Verification System In this blog, we would like to show you how you can select multiple values in search filters and ability to exclude values in filter using our Cadence Learning and Support Portal (https://ow.ly/nMVg50Sv6vt). #Cadence #Pegasus #PhysicalVerification #DigitalDesign ow.ly/cAov30sEGKa
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Exciting news! 📣 Cadence has reached major milestones in our collaboration with Intel Foundry. Together, we’re advancing technology with 3D-IC enablement, advanced EDA flows, and IP development, starting with the groundbreaking Intel 18A. We’re proud to unveil our complete EMIB 2.5D packaging flow, optimized Intel 18A flows, and an expansive IP portfolio. It’s innovation at its best, paving the way for the #AI era! ✨ #Cadence #IntelFoundry https://ow.ly/T02W50SuHAp
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Among the elite motorsports teams, McLaren Racing stands out as an emblem of innovation. With a rich legacy of competitive racing, McLaren's commitment to aerodynamic optimization is central to its success in this high-velocity arena. Cadence, an Official Technology Partner of the McLaren Formula 1 Team, plays a pivotal role in this quest for aerodynamic supremacy. Through this multi-year partnership, McLaren has access to Cadence Fidelity CFD Software, which provides innovative aerodynamic prediction tools that accelerate the team’s path toward success. Read more: https://ow.ly/UoGs50SrrgU
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Dive into an enlightening conversation with Cadence’s Vice President of Silicon Signoff, Sharad Mehrotra, on how the Tempus Timing Solution is revolutionizing large chip signoff. Check out the EDACafe interview here: https://ow.ly/rKEU50SrrgZ
EDACafe.com: Videos - EDACafe Bunker Broadcast : Signing off 1B+ Cells Design with Tempus Timing Solution - Cadence
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Really a great place to work is Cadence and we are now recognized as a Best Workplace in the Bay Area! 🌉 Our company culture, story, and network are deeply connected to the San Francisco Bay Area, and we’re proud to call it home. 🤩 Learn more about Life at Cadence: https://ow.ly/Ill650SjBTK #WeAreCadence #BayArea #BestWorkplaces
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Exciting Collaboration Update! 📣 Pegasus Physical Verification We have an excellent ongoing collaboration with Samsung Foundry, advancing #AI and 3D-IC semiconductor designs. Together, we're pushing the boundaries of technology to deliver innovative solutions for the industry's most demanding applications. Discover how Cadence and Samsung are accelerating chip innovation and helping businesses achieve first-pass silicon success. #DigitalDesign #PhysicalVerification #3DIC #Cadence #SamsungFoundry #Signoff Read the press release: ⤵️ https://ow.ly/ZqsZ50SjcCQ
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Exciting Collaboration Update! 📣 We have an excellent ongoing collaboration with Samsung Foundry, advancing #AI and 3D-IC semiconductor designs. Together, we're pushing the boundaries of technology to deliver innovative solutions for the industry's most demanding applications. Discover how Cadence and Samsung are accelerating chip innovation and helping businesses achieve first-pass silicon success. Read the press release: ⤵️ https://ow.ly/BWTQ50SjcBZ
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