Advanced Packaging Is Radically Reshaping the #Chip Ecosystem 💡 Periodically, analysts commenting on the chip industry will pronounce that Moore’s Law is obsolete. Yet while the speed of progress is slowing down, #chipmakers are still doubling the number of #transistors on an integrated circuit (#IC) approximately every 2.5 years. In the past, fundamentally new approaches for chip design never seemed to catch on. That’s no longer the case as fresh ideas that are essential for running some of today’s most important applications are rapidly gaining favor. One of the most significant of these new concepts is #advancedpackaging, which essentially accommodates an ever-increasing number of transistors by decreasing the size of electrical contacts. Traditionally, a #semiconductor chip focuses on performing one particular action or process. By comparison, an advanced multichip package incorporates multiple chips and processes into one component. This transformative approach integrates a multitude of semiconductor components into a single package, directly addressing the most critical semiconductor technical and commercial constraints. A very big thank you to my friend Dr. Karl Breidenbach and his colleagues Joseph Fitzgerald, Jan H. Mohr, Dr. Nadim Sah, Dr. Jörg Jeschke, Dr. Karl Breidenbach, Nicola Kerschbaumer, Sohini Kar from Boston Consulting Group (BCG) for the full article with more background, charts and insights via the link below 💡🙏👇 https://lnkd.in/eVvUhbKf #semicondcutorindustry #semiconductors #semiconductor #chip #ic #technology #tech #chiplets #chiplet #foundry #innovation #icdesign #tsmc #samsung #intel #geopolitics #usa #taiwan #southkorea #it #ai
I appreciate the comments around OSATs finding their place. Interested which technologies they may adopt to keep the market share from moving to IDMs and foundries?
Thanks for sharing Marco Mezger! Greetings to Japan.
Thanks for sharing Marco
Which part of the semi market will this reshape? Leading edge memories and CPUs/GPUs? What about the rest? Where else would we see Advanced Packaging? Any insights?
VP Product Management ARRI Camera Systems
1moHi Marco, thx for the insights but doesn’t seem like there is anything new here. In general I love the insight you provide on advanced packaging technologies and the real updates from the industry that I don’t need it condensed in such a format. But maybe valuable for others getting into the field