Conferences

BRAINS 2024 Call For Papers

Web3, Blockchain and Distributed Ledger Technologies (DLT) have the potential to disrupt any domain involving coordination among autonomous resources. This includes finance and payments (e.g., fintech), but also networks (e.g., power grids or telecom networks), computing (e.g., brokering of edge resources), IoT (e.g., supply chain, V2X or industry 4.0) or service platforms (e.g., identity management).

BRAINS conference is dedicated to these advances that could make the world of networks and services more secure while enabling new distributed business models.

Areas of interest include, but are not limited to:

Fundamentals of Blockchain and DLT

• Theoretical contributions to Blockchain, DLT and decentralized storage
• Distributed consensus and fault tolerance solutions, including domain-specific consensus
• Protocols and algorithms
• Distributed ledger analytics
• Trade-offs between decentralization, scalability, performance, and security
• Layer 2 solutions for scalability and privacy
• Blockchain interoperability and cross-chain mechanisms
• Storage solutions and data availability

Fundamentals of Decentralized Apps, Smart contracts, and chain code:

• Languages and tooling for dApp development
• Security, privacy, and forensics 
• Transaction monitoring and analysis
• Collaboration between on-chain and off-chain code
• Token Economy, incentives, and protocols
• Distributed trust
• Oracles
• Blockchain as a service
• Blockchain-defined networking
• Web3, IPFS

Application and service cases of DLT and Smart contracts:

• Identity management
• Finance, payments, and fraud detection and prevention
• Decentralized Finance (DeFi) and payments
• IoT and cyber-physical systems
• Smart grids and Industry 4.0, including dataspaces
• Supply chain management
• V2X, connected and autonomous vehicles
• Networking, Edge, and Cloud technologies
• Blockchain for Beyond 5G and 6G technologies
• Blockchain and AI
• Service or resource marketplaces
• Public sector Blockchain solutions and infrastructures
• Blockchain for education, public administration, health
• Results from large collaborative projects on these topics
• Blockchain for Business Process Management
• Blockchain for Metaverse and Digital Twins
• Regulations and policies

Submission Guidelines

Submitted papers must represent original material that is not currently under review in any other conference or journal and has not been previously published. All submissions should be written in English following the Two-Column IEEE Conference Format, with a maximum of eight (8) pages (Full Papers), four (4) pages (Short Papers and work in progress), or two (2) pages (Poster Papers), including text, figures, and references. Papers should be submitted through EDAS at: https://edas.info/N32188.

Student Track

We encourage the submission of student papers (i.e., all authors of the paper must be MSc or PhD students) on the topics mentioned in the CFP. Student papers have to be clearly stated on the first page. The papers should follow the same guidelines as regular papers and be submitted on the dedicated track for student papers?

Best paper awards

Two best paper awards will be delivered:

• Best Full Paper Award
• Best Student Paper Award

https://brains.dnac.org/2024/

Welcome to the 7th ETLTC International Conference on ICT Integration in Technical Education! We are thrilled to have you join us for this exciting gathering of educators, innovators, and thought leaders from around the world. Over the next few days, we will explore the dynamic intersection of technology and education, delving into the latest trends, best practices, and transformative ideas in technical education. This conference promises to be a platform for lively discussions, insightful presentations, and valuable networking opportunities. Together, we will chart the course for the future of technical education, harnessing the power of ICT to enhance learning experiences and empower the next generation of skilled professionals.

ETLTC-ICETM 2025-https://www.interconf-etltc.net/
Date: 21–26 January 2025
Proceedings are Scopus-indexed. Special Issue Scopus-indexed journal publication is possible.
Deadline for Submissions: 5th December 2024 (reasonable extension possible upon request)
Submission Link: https://www.interconf-etltc.net/submission
Call for Papers: https://www.interconf-etltc.net/cfp / https://www.interconf-etltc.net/cfp/tracks

https://www.interconf-etltc.net/

We warmly invite scientists, academicians, young researchers, business delegates, and students worldwide to join us at the World Summit and Expo on Electronics and Electrical Engineering, taking place from May 8th to 10th, 2025, in Budapest, Hungary.

The primary goal of WSEEE-2025 is to provide a platform for global participants to exchange ideas and experiences with peers from diverse regions. This gathering aims to facilitate the establishment of research or business connections for delegates and to foster international collaborations for future endeavors in their respective career paths. We anticipate that the outcomes of WSEEE-2025 will significantly contribute to the advancing knowledge base in these contemporary scientific domains.

Your expertise in areas such as Renewable Energy, Robotics, AI, and other related fields would greatly enhance our discussions. Your keynote address would be a highlight of the event, inspiring our diverse audience of professionals, researchers, and industry leaders.

We invite you to secure your place today and be part of this dynamic convergence of minds.

Event Name: WSEEE-2025
Venue: Budapest, Hungary
Dates: May 08–10, 2025
Website: https://electricalengineering.scientificsummits.org/

Submit Your Abstract Here

Register to the Conference Here

For any queries, please contact us at [email protected]

https://electricalengineering.scientificsummits.org/