Exciting news! 📣 Cadence has reached major milestones in our collaboration with Intel Foundry. Together, we’re advancing technology with 3D-IC enablement, advanced EDA flows, and IP development, starting with the groundbreaking Intel 18A. We’re proud to unveil our complete EMIB 2.5D packaging flow, optimized Intel 18A flows, and an expansive IP portfolio. It’s innovation at its best, paving the way for the #AI era! ✨ #Cadence #IntelFoundry https://ow.ly/T02W50SuHAp
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INTEL + SIEMENS = Energy-efficient CHIP manufacturing factory!! 👏👏👏👏 . . . . INTEL and SIEMENS had announced a 3 year long deal to improve INTEL's factory efficiently. The focus will be on energy efficiency and sustainability. INTEL is moving towards a NET 0 carbon footprint. That's the reason they are going for efficient natural resources. INTEL to compete with TSMC, they are undergoing a multibillion-dollar shift in its manufacturing operation i.e. cutting-edge CHIP tech EUV lithography. INTEL is the 1st company that is going to partner with SIEMENS to transform its manufacturing operation. Thoughts?? #semiconductors #intel #siemens #vlsi #chips #embeddedsystems
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INTEL + SIEMENS = Energy-efficient CHIP manufacturing factory!! 👏👏👏👏 . . . . INTEL and SIEMENS had announced a 3 year long deal to improve INTEL's factory efficiently. The focus will be on energy efficiency and sustainability. INTEL is moving towards a NET 0 carbon footprint. That's the reason they are going for efficient natural resources. INTEL to compete with TSMC, they are undergoing a multibillion-dollar shift in its manufacturing operation i.e. cutting-edge CHIP tech EUV lithography. INTEL is the 1st company that is going to partner with SIEMENS to transform its manufacturing operation. Thoughts?? #semiconductors #intel #siemens #vlsi #chips #embeddedsystems
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Intel has taken a groundbreaking step by being the first to utilize ASML's cutting edge High NA EUV lithography tools, setting the stage for a new era in chip technology. These tools, worth €350 million each, promise smaller, faster chips, elevating Intel's competitiveness in the market. Despite the financial and engineering risks, Intel's confidence in the cost effective potential of these tools underscores their commitment to innovation. With lithography being a key factor in chip size and performance, Intel's adoption of High NA technology signals a strategic advantage over rivals. By embracing EUV technology, Intel aims to overcome past setbacks and maintain its position at the forefront of semiconductor innovation. For more details click the link in bio! #Intel #ASML #chiptechnology #innovation #semiconductors #EUV #lithography #investing #stockmarket #techindustry #AI #TechNews #StockMarket #Innovation #TechStocks #Investing #MarketTrends
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Intel has announced its new roadmap for its next-gen process nodes at IFS Direct, including 14A and updates on previously announced nodes. Additionally, Intel has launched Intel Foundry, a more sustainable systems foundry business designed for the AI era. The company also announced an expanded process roadmap designed to establish leadership into the latter part of this decade. Intel's customers and ecosystem partners, including Synopsys, Cadence, Siemens, and Ansys, have expressed their readiness to accelerate Intel Foundry customers' chip designs with tools, design flows and IP portfolios validated for Intel's advanced packaging and Intel 18A process technologies. The announcement was made at Intel's first Foundry event, Foundry Direct Connect, which brought together customers, ecosystem companies, and industry leaders, including U.S. Secretary of Commerce Gina Raimondo, Arm CEO Rene Haas, Microsoft CEO Satya Nadella, OpenAI CEO Sam Altman and others. #intel #ifs #techgiants #chips #foundries #semiconductor #semiconductors #semiconductorindustry #innovation #technology #technologynews
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https://lnkd.in/gte9t4eY AMD CEO Lisa Su is coming to the Code Conference. > AMD is all in on AI as Su leads the company through another major transformation. #amd #ai #Semiconductorindustry #electronics #semiconductor #supplychain #manufacturingtechnology #processtechnology #engineering #manufacturing #technology #computerchips #business #innovation #semiconductors #chips #chipmaker #foundry credit: theverge
AMD CEO Lisa Su is coming to the Code Conference
theverge.com
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We've been hearing a lot from Intel Corporation in the past few weeks as rolled out its Foundry Direct Connect as "the first systems foundry for the #AI era." The get-together laid out some additional plans for Intel’s foundry effort. Intel has a full array of IP and EDA vendors, including our member companies Siemens EDA (Siemens Digital Industries Software) and Cadence Design Systems. In his latest blog post, Dean Freeman shares what the industry pundits are saying about this latest Foundry effort: Will it flounder like previous attempts? Or will it prevail? https://lnkd.in/gEt5vFk5
Will the Intel Foundry Model Succeed? - 3D InCites
3dincites.com
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This question is... Is their enough incremental 12 nm demand to utilize the fabs in an economically viable way. Seems to reflect that Intel doesn't see much demand for 7nm and below chips. I'll dig into the product mix question. Yields on the 7nm node are still less than 1/2 of TSMC yields on 3nm. The economics just don't add up. Intel pushed out the Ohio fabs, in order preserve scare capital, another year today. Process maturity on all nodes going forward won't meet traditional exit criteria from Ronler to the VF. The gap continues to widen WRT foundry competition and AI competition. Our New Year estimate that Intel would be down 30 to 50% this year and AMD and Nvidia up 60 to 80% is on track. Intel down 13% in January, AMD and Nvidia up 30%+ in January alone TSMC will eat Intel's lunch too on the foundry front; they are already up 12+% This year...
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The new 12nm node will be produced in three of Intel's Arizona fabs beginning in 2027, marking a big step towards the US's strategic goals of bolstering semiconductor self-sufficiency. #IAmIntel
Intel and UMC team up on chip manufacturing - Intel will produce jointly developed new 12nm process node in its US fabs
share.intel.com
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TSMC SAYS IT DOESN'T NEED HIGH-NA EUV CHIPMAKING TOOLS FOR 1.6NM-CLASS NODE, BUT INTEL HAS CHAMPIONED THE TECH Article Summary: 1. #TSMC unveils A16 process technology with Super Power Rail backside power delivery at North America Technology Symposium 2024. 2. Unlike #Intel's approach, TSMC's A16 doesn't rely on High-NA EUV lithography, leveraging innovative techniques for cost-efficient production. 3. TSMC balances technological advancement with cost-effectiveness, exploring High-NA EUV lithography for future process technologies while optimizing existing tools for improved performance and yield. Thanks again to Tom's Hardware for the full article with more background and insights click the source link in the comments below 💡 🙏👇 Do you value meeting face-to-face with top executive leadership and decision-makers in the semiconductor industry? Experience the power of 1-on-1 business discussions at the International Semiconductor Executive Summits (ISES) events! Witness firsthand industry roadmap discussions and come experience firsthand the millions of dollars in future business collaborations that take place at this extraordinary gathering. Feel free to contact me for more details. #artificialintelligence #usa #nandflash #memory #chip
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https://lnkd.in/dMWjgHgU What's the big deal? This event will mark the public debut of Intel's implementation of EUV (Extreme Ultraviolet Technology) for high volume manufacturing. Successful high volume manufacturing using EUV technology is critically important for Intel. " ... EUV lithography is a more precise manufacturing process than previous lithography methods, which allows Intel to create smaller transistors and denser chips." (quote extracted from verified query response from Google Bard) #intel
Media Alert: Intel Starts High-Volume EUV Production in Ireland
intel.com
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🔊 Tuesday, Feb 20, 2024 1. #NVIDIA Jensen Huang: Advances in computing #technology will significantly reduce the cost of #AI 2. #Qualcomm commissions #TSMC and #Samsung to develop #2nm prototype #chips, or select a mass production company before the end of the year 3. #OpenAI approached TSMC to build a #wafer #factory and planned to raise US$7 trillion to build dozens of factories. 4.#TDK: There will be no V-shaped recovery in demand for #electronic components in #2024
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