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The three-dimensional integration of electronic and photonic integrated circuits could solve critical input/output limitations in existing computing chips, and create larger, more complex chips for application in future data centres and high-performance systems.
Two-dimensional (2D) semiconductors could be used to build advanced 3D chips based on monolithic 3D integration. But challenges related to growing single-crystalline materials at low temperatures — as well as enhancing the performance of 2D transistors — need to be addressed first.
Three-dimensional technology — which can offer enhanced integration density and improved data communication — will be required to build large-scale artificial computing systems inspired by the brain.
Next-generation optoelectronic devices — including quantum dot and perovskite light-emitting diodes — could be used to build stretchable and multifunctional displays.
As the scale and application of artificial intelligence technologies continues to grow, addressing challenges related to the wider accessibility of the underlying technology becomes increasingly important.
Wearable sweat sensors could be used to monitor patients with heart failure, providing a route to personalized and automated patient management in hospitals and at home.