Wide Bandgap Semiconductor: From Epilayer to Devices

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Semiconductor Devices".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 9944

Special Issue Editors


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Guest Editor
Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan
Interests: solid-state lighting devices; solar cells; power device; HEMT; flexible electronics; optoelectronics; nitride and oxide semiconductor MOCVD growths
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Guest Editor
Department of Electrical and Electronic Engineering, University of Cagliari, Cagliari, Italy
Interests: reliability; degradation mechanisms; failure analysis; microelectronics; semiconductor devices; counterfeit electronics

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Guest Editor
Department of Electrical and Electronic Engineering, Saga University, Saga 840-8502, Japan
Interests: MOCVD; thin films; GaAs; semiconductor device physics; epitaxy

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Guest Editor
International College of Semiconductor Technology, National Chiao Tung University (NCTU), Hsinchu City 30010, Taiwan
Interests: single event effect (SEE) in semiconductor devices; electrostatic discharge (ESD) and transient voltage suppressors (TVS); power semiconductor devices

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Guest Editor
Nanomaterials Science Unit, Thin Film Physics Division, Department of Physics, Chemistry, and Biology, Linköping University, 58183 Linköping, Sweden
Interests: materials science; physical vapor deposition; magnetron sputter epitaxy; molecular beam epitaxy; nitride semiconductors; thin films; nanostructures; nanodevices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

According to the U.S. Department of Energy’s Advanced Research Project Agency for Energy, by 2030, 80 % of electricity will flow through a power electronic device. Power electronic devices are competent in controlling and converting electrical power consumption and are utilized in home appliances, automotives, industries, defense system, aerospace, renewable energy systems, and utility systems.  In the modern world, energy-efficient reliable electronic devices are inevitable to reduce power consumption. Recently, wide bandgap (WBG) semiconductors have emerged as potential candidates for next-generation power electronic devices with advantages such as larger operating temperature, energy efficiency, high carrier mobility, high critical breakdown fields, faster switching, and high radiation resistance. Silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), aluminum nitride (AlN), and diamond WBG power electronics devices are facilitating the miniaturization of devices with more reliability and efficiency.

The present Special Issue of Electronics is planned as a collection of reviews and research articles on the epitaxy of WBG semiconductors and devices related to the area. The potential topics of interests include but are not limited to research on epitaxy, simulations, characterizations, and devices of SiC, GaN, Ga2O3, AlN, and diamond.

Prof. Dr. Ray-Hua Horng
Dr. Giovanna Mura
Prof. Dr. Qixin Guo
Prof. Dr. Chin-Han(King) Chung
Dr. Ching-Lien Hsiao
Guest Editors

Manuscript Submission Information

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Keywords

  • wide bandgap
  • power device
  • SiC
  • GaN
  • Ga2O3
  • diamond

Published Papers (5 papers)

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