Join us at the JSAE Automotive Engineering Exposition 2024. From July 10th through 31st, you can discover our total solutions for next-gen #automotive. At our virtual booth, dive into innovations to improve EV charging, #ADAS systems, domain controllers and more. For example, explore how DuPont Silveron™ GT-820 Silver-Tin provides an ideal alternative for tin for high reliability press-fit connectors. Learn more about Silveron™ GT-820 here: https://lnkd.in/gkAYRBeX Register for the JSAE Automotive Engineering Exposition here: https://lnkd.in/gagfjz3q
DuPont Interconnect Solutions
Appliances, Electrical, and Electronics Manufacturing
One-stop leading materials solutions for advanced interconnect and specialty industrials.
About us
DuPont Interconnect Solutions solves signal integrity and power and thermal management challenges with advanced interconnects from chip packaging, IC substrate, PCB to assembly. We enable mega trends of AI, high-performance computing, electric vehicles, ADAS, 5/6G, smart consumer electronics, and high-reliability industrials. With our industry-leading and comprehensive product portfolio, we enable high performance, reliability, and innovation across the electronics, automotive, telecom, healthcare, and aerospace industries. These include Kapton® polyimide films, Pyralux® laminates, metallization, dielectrics, photoresist, Skyton® conductive inks, thermal interface materials (TIM 1 and 2), EMI solutions, inductive components, and specialty silicones. With deep material science expertise, advanced applied engineering capabilities, a broad product portfolio, and a commitment to sustainability, DuPont Interconnect Solutions is a leading partner of choice for system design, product engineering, and demanding materials solutions.
- Website
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https://www.dupont.com/electronic-materials.html
External link for DuPont Interconnect Solutions
- Industry
- Appliances, Electrical, and Electronics Manufacturing
- Company size
- 10,001+ employees
Updates
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In high-vibration applications, design engineers need soft solutions that work flawlessly without putting stress on the chip. Laird’s new Tflex™ CR350S is an ultra-soft thermal gap filler that protects components during shock or vibration while maintaining low thermal resistance. Learn more and request samples today: https://lnkd.in/ggYA7YgA
Tflex™ CR350S Thermal Gap Filler
laird.com
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See our new “Where to Buy” section at Laird.com to more quickly locate sources of Laird™ brand products. The newly enhanced webpage shares details about Laird distributors, converters, and U.S. manufacturer representatives. You can also uncover distributor inventories through Octopart and reach Laird’s engineering team to discuss custom solutions to meet any design needs.
Laird | Where to Buy
laird.com
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Enhancing design freedom with domain controllers, central vehicle controllers, infotainment smart boxes and more, Laird’s new BMI-S-608 shield frame is a one-part shielding solution permitting tighter spacing between adjacent shields and easier repairs. It consists of a four-sided shield frame with no top-mount cover thus saving materials costs. Instead, the diecast/heat sink main housing is placed inside the shield frame and is clasped tightly by integrated contact spring fingers. They create electrical contact and grounding. The snug fit ensures direct, surface-to-surface contact with integrated circuits. Learn more: https://lnkd.in/g-VxgH2N
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Featuring a unique, pyramidal design, ReZorb™ S elastomeric absorber limits noise, EMI disturbance and antenna pattern side lobe distortion. Request a sample today: https://lnkd.in/gqwjDpAw
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Hear from Eric Lin, Laminate Commercial Leader for APAC at DuPont Interconnect Solutions, about all of the innovations we’re discussing at the JPCA Total Solution Exhibition for Electronic Equipment 2024. If you’re at the show, be sure to stop by the DuPont Interconnect Solutions booth and learn about our total solutions for signal integrity and thermal management.
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We’re excited to be on site at the JPCA Total Solution Exhibition for Electronic Equipment 2024. Our team of experts is sharing with attendees our range of solutions for fine line and advanced packaging of advanced interconnects. Hear from Urushihara Nobuyoshi, Japan & Landed Japan Operation Sales Leader for Advanced Circuit and Packaging at DuPont, some of our latest solutions driving innovation in #AI technologies.
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Anthony Rardin, Americas Commercial Leader at DuPont, recently sat down with Global SMT & Packaging at #IPCAPEX to share some of DuPont Interconnect Solutions' latest innovations. Check out the conversation to learn more about flexible and durable materials that support #PCB manufacturing. From our new Pyralux® ML, which offers optimal thermal management for extreme environments, to Silveron™ high-durability silver for lasting conductivity, our total solutions offerings address a variety of needs and challenges to drive innovation.
DuPont demonstrate some of the latest advances in materials science
https://www.youtube.com/
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DuPont’s Richard Wessel, Applications Technology Manager, sat down with Sanjay Gangal of EDA Cafe to discuss our recent launch of Pyralux® ML at IPC APEX! During the interview, Rich delves into the distinctive qualities of Pyralux® ML, and discusses the integration of our new laminate solution into our current product portfolio. He also highlights the key advantages our customers will gain from implementing Pyralux® ML to address thermal management. Click below to watch the full interview! #Laminates #ThermalManagement #IPCAPEX https://lnkd.in/gmekxkGw
EDACafe.com: Videos - EDACafe Bunker Broadcast : Richard Wessel, Applications Technology Manager - DuPont Electronics & Industrial
edacafe.com
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Visit DuPont Interconnect Solutions at The Total Solution Exhibition for Electronic Equipment 2024! Stop by booth #5F-09 to uncover our latest innovations in advanced circuit materials and solutions. DuPont Interconnect Solutions experts will be on site to share our range of total solutions for advanced interconnects, and provide expert guidance to help solve pressing challenges related to miniaturization, signal integrity, and thermal management for high-speed and high-frequency connectivity.
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