Arieca Inc.

We are here at PCIM Europe! Fantastic vibes and great conversations with potential collaborators. You can find us at exhibit hall #6 #LiquidMetalEmbeddedElastomers #PowerModules

We are looking forward to attending next week’s PCIM Europe conference in Nuremberg, Germany, and hope to see you there! Come stop by at Booth 6-159 (in the Newcomer Pavillion) to learn how liquid metal embedded elastomers (LMEE) can solve your thermal management problems. Additionally, be sure to check out the presentation by Yo Mochizuki, from our collaborators at ROHM Co., Ltd., on Thursday June 13th, 1400-1420. Yo will be showing how LMEE can help with reliability issues on large area bonds between power modules and cooling systems. (link to the presentation in the first comment) #semiconductor #powerelectronics #thermal #LiquidMetal #pcimeurope

We are grateful for the support from National Science Foundation (NSF). Here is an article published at AIChE - American Institute of Chemical Engineers, highlighting our work partially funded by NSF SBIR Phase II targeting development of a liquid metal-based TIM that provides a low thermal resistance that rivals a solder TIM (<5 mm2K/W) while maintaining stretchability greater than 250% (allowing the TIM to stretch to 3.5x its original length). Reach out to us if interested in an evaluation! #semiconductor #ThermalInterfaceMaterials #LiquidMetal #NSF https://lnkd.in/eP23EdNW

This is a fantastic development for the On-shoring of the Semiconductor Packaging industry! Amkor Technology, Inc.

Today is a fantastic one for #CHIPS for America with the signing of the National Semiconductor Technology Center (NSTC) Consortium agreement. Leaders from the U.S. Department of Commerce (Gina Raimondo, Laurie Locascio), United States Department of Defense (Kathleen Hicks), U.S. Department of Energy (DOE) (Jennifer Granholm); and the National Science Foundation (NSF) (Sethuraman Panchanathan); and the Chief Executive Officer (Deirdre Hanford) of the National Center for the Advancement of Semiconductor Technology (Natcast) will gather at the The White House to announce over $5 billion in expected investment in the #CHIPS R&D program, and formally establish a public-private consortium for the NSTC. We could not have made it this far without our Federal government partners, significant input and enthusiasm from the community, and an incredible dedicated team of public servants at U.S. Department of Commerce and National Institute of Standards and Technology (NIST). We're just getting started!

A nice article about Michael Dickey, our friend “Michael Dickey, our guide through the surprising world of liquid metals” #DickeyGroupNCSU #AdvSciNews https://lnkd.in/g5a96Pq5

Today, we celebrate the opening of Intel Corporation's first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor, and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico Team. I am so proud of our #manufacturing, technology development, suppliers, construction partners, and local operations teams for their perseverance and dedication. Your commitment to minimizing our environmental footprint in the region during construction and operations is inspiring. To Gov. Michelle Lujan Grisham, Senator Martin Heinrich, Senator Ben Ray Lujan, and other elected officials, thank you for your support and collaboration. As Intel continues to push the boundaries of #packaging innovation in high-volume manufacturing, I’m excited to see New Mexico lead the charge for the rest of the industry. #IAmIntel https://lnkd.in/gzCr8Dtv

Today, we celebrate the opening of Intel Corporation's first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale. This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor, and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico Team. I am so proud of our #manufacturing, technology development, suppliers, construction partners, and local operations teams for their perseverance and dedication. Your commitment to minimizing our environmental footprint in the region during construction and operations is inspiring. To Gov. Michelle Lujan Grisham, Senator Martin Heinrich, Senator Ben Ray Lujan, and other elected officials, thank you for your support and collaboration. As Intel continues to push the boundaries of #packaging innovation in high-volume manufacturing, I’m excited to see New Mexico lead the charge for the rest of the industry. #IAmIntel https://lnkd.in/gzCr8Dtv

Updated - I have two positions. Both in the general area of thermal management of data center and thermal and mechanical challenges in heterogeneous packaging (related to CHIPS ACT) - diverse cooling technologies - cold plate, immersion (both single and two phase), and advanced heat sink development for DIMMS in a hybrid cooling (ARPA-E related - link below) My team is seeking a highly motivated and qualified individual for a postdoctoral position in Electronics, MEMS & Nanoelectronics Systems Packaging Center (EMNSPC) research group. The responsibilities will include working on an ARPA-E project entitled: “Holistic Co-Design of Novel Hybrid Cooling Technology for the Data Center of the Future.” https://lnkd.in/g_3zx-uE More information on the position is included in the attached flyer. We have an immediate need and as such, preference will be given to those that can join by mid-January 2024.

Exciting developments reported out of Intel Corporation https://lnkd.in/gHJBvjkn Looks like 2024 will be a lively year for AI enable PCs and Mobility.