Dereje Agonafer

Technical presentation and poster presentation on 'Next Generation Antenna mount' were delivered and published in conference proceedings at International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2015.

http://www.asmeconferences.org/InterPACKICNMM2015/TechnicalProgramOverview.cfm

The experimental analysis includes changing the frontal air velocity and operating different levels of pad saturation to find out how well the pad performs under the above mentioned conditions and how the efficiency of the pad system varies.

This paper investigates power migration, or “core hopping,” which involves dynamic allocation of workload among the cores on a many-core processor. This work numerically analyzed core hopping for different configurations of a many-core processor, and performed the migration based on both time of activity and temperature of individual cores. Based on the analysis, this work demonstrated a notable drop in junction temperature of about 8°C.

Analytically demonstrated the benefits of a concept using hot attic air to augment household clothes dryers. Implementation costs are very low and provides two synergistic benefits.

With the continuing industry trends towards smaller, faster
and higher power devices, thermal management continues to be
extremely important in the development of electronics. In this
era of high heat fluxes, air cooling still remains the primary
cooling solution in desktops mainly due to its cost. The primary
goal of a good thermal design is to ensure that the chip can
function at its rated frequency or speed while maintaining the
junction temperature within the specified… Show more

With the continuing industry trends towards smaller, faster
and higher power devices, thermal management continues to be
extremely important in the development of electronics. In this
era of high heat fluxes, air cooling still remains the primary
cooling solution in desktops mainly due to its cost. The primary
goal of a good thermal design is to ensure that the chip can
function at its rated frequency or speed while maintaining the
junction temperature within the specified limit. The first and
foremost step in measurement of thermal resistance and hence
thermal characterization is accurate determination of junction
temperature. Use of heat sinks as a thermal solution is well
documented in the literature. Previously, the liquid cooled cold
plate tester was studied using a different approach and it was
concluded that the uncertainty in heat transfer coefficient was
within 8% with errors in appropriate parameters, this result was
supported by detailed uncertainty analysis based on Monte-
Carlo simulations. However, in that study the tester was tested
computationally. In this paper, testing and characterization of a
heat sink tester is presented. Heat sinks were tested according to
JEDEC JESD 16.1 standard for forced convection. It was
observed that the error between computational and experimental
values of thermal resistances was 10% for the cases considered. Show less