EV Group

EV Group tops customer rankings with 12th consecutive Triple Crown Win in TechInsights 2024 Customer Satisfaction Survey We#ve achieved RANKED 1st status across all participating award categories, including first-place finish in “10 BEST” and “THE BEST” suppliers segments as well as lithography equipment for the first time. Thanks to all customers who have cast their vote - read all the details in our press release here: https://lnkd.in/d2hcaNTd

Honored to have delivered an invited talk on EVG Layer Release Technology to esteemed guests from semiconductor technology industry during advanced package and hybrid bonding tech conference hosted by TheElec last Thursday. It was a fantastic opportunity to share insights and engage with industry leaders on this innovative topic. Looking forward to more such enriching experiences!

Research is the breeding ground for new innovations - and collaborations are key. Congratulations to all involved at CEA-Leti, SOITEC and our colleagues at EVG - check out the article below.

WOW! We're delighted to receive this year's SEMI "Best of West" Award for our groundbreaking EVG®880 LayerRelease™ System. 🎉🥇 The award was handed over by Semiconductor Digest's Editor-in-Chief Peter Singer to our Executive Sales & Customer Support Director Hermann Waltl at the show in San Francisco.

Glad to be amongst the finalists for this year's Best of West award for our EVG®880 LayerRelease™ System and we're eagerly awaiting the award ceremony. Visit us at our booth 1345 to find out more!

One more sleep until #SEMICONWest opens its doors this week. Who's as excited as we are? Make sure to stop by our booth 1345 and say hello!

We’re very grateful for the trust and appreciation shown by our customers, partners and peers who voted for EVG at the MEMS World Summit EU in Porto. We received this year´s "Exceptional Equipment Supplier of the Year" Award, which was accepted by our Business Development magager Bernd Dielacher! 🎉

Tokyo calling 🎌: Visit the talks of our Insider Ksenija Varga at the 41st International Conference on Photopolymer Science & Technology and learn more about EVG’s solutions for Maskless Lithography, Nanoimprint Lithography and Advanced Packaging: 👉 Tuesday, June 26th 18:00 to 20:00 PM - Panel Discussion: “Advanced Packaging of More Moore and More than Moore Era” 👉 Wednesday, June 27th 13:20 – 13:50 PM – “Pushing the Limits of Digital Patterning by EVG’s Maskless Lithography and High–Resolution Wave Control Mosaics“ 👉 Friday, June 28th 09:00 to 09:30 AM – “Nanoimprinting Lithography – Efficient scaling of complex shaped nano patterns for high volume production” https://lnkd.in/d9AHY66R

3 days to go till EMLC 2024! Meet our Insiders from 17th to 19th June at MINATEC / CEA-Leti in Grenoble, France. Here is the timetable: 👉 Invited Talk: “Traceability in Automotive Enabled by Digital Lithography“ Wednesday, June 19th from 14:10 to 14:30 PM   👉 Oral Presentation: “Utilizing Inkjet Coating and Nanoimprinting for Complex 3D Patterns with Gradual Height Increase and Minimal Residual Layer” Wednesday, June 19th from 16:35 to 16:50 PM   👉 Poster Presentation: “Cost–effective Nanoscale Process Control Enabled by EVG's Metrology Systems” Tuesday, June 18th from 17:30 to 19:00 PM https://lnkd.in/ebRuJrj

Better together 🤝: EV Group and Fraunhofer IZM-ASSID expand their partnership in Wafer Bonding for Quantum Computing Applications! The strategic partnership kicks off with the installation of an EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden, Germany. Read more about the partnership in our joint press release: https://lnkd.in/duSmWH_U