WeEn Semiconductors’ Post

I will be at #PCIM for the second time, do not hesitate to stop by on booth 538 hall9, to hear about latest update of our power semiconductor technologies and about strengths, advantages, how-to be fast in time-to-market, how-to be more competitive by using #WeEn products in your power application. #ween_semiconductor #SiC #IGBT #Si_Mosfet #Thyristors #FRD #Power_Modules

🌐 In a world where the demands on semiconductor manufacturing are constantly evolving, the need for flexible, adaptable metrology tools has never been greater. Traditional tools, often too monolithic for the rapidly changing landscape, have left a gap in the market for innovation. ▶ The Wafer Metrology Center #WMC #Penta - #Euripides² project has developed an industry-open, modular wafer metrology platform for a wide #semiconductor application range. Carrying up to 10 different sensors, this platform isn't just flexible; it's designed to incorporate both in-house developed sensors and those from other vendors, thanks to its standard interface. 🎯 Through the WMC project, the consortium significantly enhanced the platform's #flexibility and #reusability, directly contributing to the reduction of the environmental footprint. This was achieved by eliminating the need for manufacturing a new platform for each new task, marking a crucial transition from traditional, rigid metrology products to a more adaptable platform concept. Discover more in the Project Impact Summary 👇 This project is funded by 🇨🇭 🇩🇪 🇳🇱 Congratulations to the project leader sentronics metrology GmbH Bernd Srocka, PhD and involved partners CSEM Fraunhofer-Gesellschaft Lyncée Tec SA Nedinsco! This project is funded by 🇩🇪 🇳🇱 🇨🇭 Penta and Euripides² are Eureka Network Clusters, operated by AENEAS #researchanddevelopment #innovation #impact

It has been a great pleasure for Frank Thielert and myself to participate to the 31st edition of the #MAM2024 conference on behalf of confovis. We participated to fruitful discussions spanning from fundamental science to industrial applications.   The latest developments on wide band gap (#WBG) materials and devices were presented. Innovation in industries such as power electronics, renewable energy, and electric vehicles were discussed. As the world energy consumption is expected to grow by nearly 50% by 2050, it is paramount to find better power management solutions to guarantee a sustainable future. 🌳 WBG semiconductors, such as SiC and GaN, seem to be key enablers for a sustainable transition towards the next generation of efficient electronic devices.   Of particular interest to us was the talk by Delphine LE CUNFF from STMicroelectronics in which she focused on inline metrology and the challenges encompassed with the increasing complexity of manufacturing technologies. Inline metrology is a key enabler to: ·     Speed up the introduction of new technologies, ·     Secure the ramp-up of pilot lines, ·     Improve the yield of mature factories.   With the increasing demand for ICs in the automotive industry, the requirements on quality control have become more stringent. Semiconductor manufacturing is automatising every processing step and transitioning towards the industry 4.0. In this context artificial intelligence (#AI) combined with machine vision allows to automatise defect inspection and metrology in the online operation of semiconductor manufacturing.

It's great to see ST putting more focus on power electronics and becoming a leader in wide-bandgap semiconductors. Transitioning to these more efficient materials will be crucial for further advancing industries like electric vehicles, renewable energy generation, and power supplies. Edoardo Merli's vision and strategy of having an end-to-end offering from discrete devices to modules.

The IEEE conference on Emerging Technologies and Factory Automation #ETFA, addresses recent progress in the field of industrial and factory automation in an eco-system of academia and industry. I look forward delivering a keynote on the promises and realizations of the #industrialmetaverse in this year's edition. It's an honor to accompany Dr. Clara Otero (NXP Semiconductors) and Prof. Giovanni Cherubini (Huawei Research Center Zurich), setting a context for the 11 technical tracks of the conference. You can expect topics like #IT in #automation, #control, #robotics, #sensornetworks, #computervision and #HumanMachineInteraction being addressed. The conference takes place in Padova, Italy, 10-13 September and registration is open: ETFA 2024 - 29th IEEE IES International Conference on Emerging Technologies and Factory Automation (ieee-etfa.org) Dave Cavalcanti, Stefano Vitturi, Angelo Cenedese, Zhibo Pang, Alessandro Beghi, Valerio Frascolla, Dr. André Scholz

➡️Go to the current issue, ➡️swipe to magazine page 28, ➡️and read our executive viewpoint! https://lnkd.in/de5WZXAu

Did you know semiconductor devices fabricated in 2021 have a CO2 equivalent footprint of about 175 megatonnes, equivalent to the yearly emissions associated with about 30 million people? Click the link below to find out how IMEC plans to reduce emissions: https://ow.ly/cyIR50R4qB5 #ew #electronicsweekly #imec #litho #etch #sustainablemanufacturing

🕓 Tomorrow the most anticipated Senior Power Semiconductor Manufacturing Community will gather during the International Semiconductor Executive Summits in Italy! 🔌 Theme: "ECOSYSTEM ACCELERATION OF WBG POWER SEMICONDUCTORS AND THE IMPACT TO SOCIETY" 📆 Date: September 14-15, 2023 🌍 Location: Lake Maggiore, Italy 🗣️ Tomorrow, on September 14, at 16:00, our own Head of Business & Development Jeroen van Borkulo will present ‘How Laser is Enabling The Power Semiconductor Roadmap’. 🌟 New wafer singulation technologies are needed to keep up with the market trends of strong increasing Power Semiconductor Applications and higher Electrical Performance requirements. Therefore, wafers get thinner and move to Si to SiC and GaN wafer substrates. ASMPT ALSI developed patented Ultra-Violet (UV) nano second laser dicing technology for thin SiC wafers (100-150 µm). This allows the market to continue their technology roadmap and lower the Cost-of-Ownership to the conventional saw blade dicing technology: a technology that knows a lot of issues due to the hardness of SiC, high consumable costs and low throughput. We hope to meet you during Jeroen’s presentation or during the networking breaks #ISESEUPOWER2023 #SemiconductorEvent #Laserdicingtechnology #Innovation #SiC #GaN  #ASMPTALSI #ASMPT

The #CMOS and #sCMOS Image #Sensor market industry is projected to grow from USD 22.23 Billion in 2023 to USD 37.91 Billion by 2032, exhibiting a compound annual growth rate (CAGR) of 6.90% during the forecast period (2023 - 2032). Increasing use of #digitalimages, the need for high-resolution imaging is growing, increasing use in surveillance and #automobile and increasing need for #medicalimaging, are the key market drivers enhancing the market growth. Browse Full Research Report@ https://lnkd.in/gRJYq5F Key Companies Profiled- BAE SYSTEMS PLC, Sony Electronics, Canon Inc., Panasonic, Galaxycore Inc., SK hynix., onsemi, OmniVision Optoelectronics Technologies (Shanghai) Co Ltd., Samsung Electronics, Teledyne Technologies Incorporated., Sharp Electronics Corporation USA #sensors #technology

📰 We've been featured in Markt&Technik about our #chiplet demonstrator collaboration with Fraunhofer IIS, Division Engineering of Adaptive Systems EAS: "How #chiplets are making their way into medium-sized companies": https://lnkd.in/e8kR-bac (page 17). Our collaboration with Fraunhofer IIS/EAS is driving progress in chiplet integration, aiming to overcome challenges and make high-performance chiplet-based systems accessible to medium-sized companies. The original chiplet vision offers manufacturing flexibility for various quantities. While standardization efforts have begun, the collaboration addresses gaps in testing compatibility at the electrical level. There's significant industry interest, especially from #automotive manufacturers and medium-sized companies, seeking chiplet development. Achronix's role in developing a chiplet demonstrator is leveraging our adaptable #FPGAs for optimal system performance that will address challenges such as interposer choices and supply chain adjustments. The collaboration is confident in establishing chiplets, promising higher performance, reduced power consumption, and enhanced resource efficiency. Stay tuned for updates on this innovative journey! 💡 #Semiconductor #ChipletTechnology #FraunhoferIIS