Semiconductor Industrial Breaking News
1. The Next Platform reported, Forrest Norrod, executive VP and GM of AMD's Data Center Solutions Division, said in an interview recently that AMD will help build the world's largest single artificial intelligence (AI) training cluster, which will integrate up to 1.2 million GPUs.
2. Intel has made breakthrough progress in silicon photonics integration technology for high-speed data transmission. At the 2024 Optical Communications Conference (OFC), the Intel Silicon Photonics Integration Solutions (IPS) team demonstrated the industry-leading fully integrated OCI (Optical Compute Interconnect) core, which is packaged with Intel CPUs and can run real data with bidirectional data transmission speeds of up to 4 Tbps. Targeted at data center and HPC applications, the Intel OCI core enables co-packaging of optical I/O (input/output) in emerging AI infrastructure, thereby driving innovation in high-bandwidth interconnect technology.
3. Infineon launches powerful CYW5591x family of connected MCUs.
4. Etched has developed an ASIC chip called Sohu, which is specifically designed for Transformer models. Etched claims that the Sohu chip can perform 20 times faster inference on Llama-3 70B than Nvidia’s H100, while consuming significantly less power.
5. Samsung and SK Hynix are in talks with Korea Development Bank (KDB) for chip loans, according to a report in the Korea Economic Daily.
6. Micron said that HBM memory chips for 2024-25 are sold out; memory chips are in short supply; and there is uncertainty in industrial and retail demand.
7. Huang Renxun believes that the Blackwell architecture platform is likely to become the most successful product in Nvidia's history and even in the entire history of computers. He pointed out that after comprehensively considering performance and operating costs, Nvidia's products will be the most economically valuable.
8. As the demand for AI servers continues to rise, TSMC is accelerating the expansion of CoWoS. Equipment manufacturers said that the current CoWoS supply gap is quite serious. Although equipment manufacturers have delivered the large orders placed at the beginning of the year in recent months, the growth rate of demand has completely exceeded expectations, and TSMC has once again placed urgent orders with equipment manufacturers. In addition, according to previous estimates, the visibility of orders on hand from Honsu, Xinyun, and Junhua alone will last until 2027. It is estimated that in the second half of 2024, TSMC's CoWoS monthly production capacity is expected to gradually increase from the original 32,000 pieces to 40,000 pieces, and in 2025, the monthly production capacity will be increased to 58,000 pieces until the production capacity of the new Chiayi plant is opened in 2028. The production capacity will increase year by year during this period. Taiwan Electronic Times reported.
Customers are going to love the sound of lower latency and lower power consumption for their #AI infrastructure.