SUSS MicroTec’s Post

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We are excited to attend SEMICON West in San Francisco - one of the most important events in our industry calendar.    This gathering of semiconductor professionals provides an invaluable opportunity to connect with customers, partners and colleagues. Numerous colleagues, including from the headquarters in Munich near Garching, will be on site. We look forward to the insights and inspiration that SEMICON West promises.    And now the best parts: ➡️ We present our product portfolio, including the recently launched hybrid bonding all-rounder XBC300 Gen2 D2W/W2W. It is a world first and enables wafer-to-wafer hybrid bonding as well as collective and sequential die-to-wafer hybrid bonding. 🎂 We are also looking forward to celebrating the 75th anniversary of SÜSS MicroTec together with you on site. And what would a birthday party be without a cake? Simply unimaginable! That's why our CEO Burkhardt Frick will be cutting a special cake on 10 July.     We welcome everyone to visit our booth 533.  Let's connect and move the industry forward together.   Who do we meet on site? #sussmicrotec #semiconductor #SEMICONwest 

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