💼 Are you working for a business wanting to adopt additive manufacturing technology but is unsure how to take the first step? 🤝 Join the "Collaborate to Innovate: Sustainable Business Strategies with Additive Manufacturing" event organised by NAMIC hubs at Singapore Polytechnic, Temasek Polytechnic and Nanyang Polytechnic. 💡 This one day event on 19 July, will give you the chance to network, learn and discover new business opportunities to leverage AM for sustainable business growth with the polytechnics. 🗣️ Speakers from ST Engineering Aerospace, GE Aerospace Engine Services Singapore, GlobalFoundries and Pelagus 3D will share about their AM experience and challenges. Register your interest today! https://lnkd.in/gFXy4ySW 👉 For more information, visit https://lnkd.in/ggf5Dqxi #AdditiveManufacturing #Singapore Enterprise Singapore Singapore Manufacturing Federation Singapore Semiconductor Industry Association (SSIA) AutomationSG Association of Singapore Marine & Offshore Energy Industries (ASMI) Singapore Precision Engineering And Technology Association
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🎉 Congratulations to Dr. Chaw Sing HO and the exceptional team at NAMIC Singapore for organizing the immensely successful Global Additive Manufacturing Summit 2023! 🌍 This remarkable event has showcased the incredible advancements in additive manufacturing, highlighting its pivotal role in shaping the future of various sectors. The progress we've witnessed in additive manufacturing is truly amazing. Particularly, in industries like semiconductors, the integration of additive manufacturing technologies presents a game-changing opportunity. By leveraging these technologies, companies can drive down costs, enhance efficiency, and significantly contribute to their sustainability goals. Kudos to everyone involved in this summit for driving innovation, fostering collaboration, and propelling the additive manufacturing industry to new heights. Here's to a future filled with endless innovations and sustainable solutions! Looking forward to closer collaboration with NAMIC to bring additive manufacturing solutions to the semiconductor industry!🌟 #AdditiveManufacturing #Innovation #Sustainability #GlobalSummit2023 #ssia #singapore #sg #semiconductormanufacturing #semiconductors #electronics
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🌏 ECOSYSTEM ACCELERATION OF WBG POWER SEMICONDUCTORS AND THE IMPACT TO SOCIETY will be the Theme of the highly anticipated Senior Executive Gathering Exclusively for the Power Semiconductor Manufacturing Community covering major topics in SiC & GaN Technologies will be hosted on September 14-15 in Italy, Lake Maggiore. 🗣️ We welcome Speaker Dr. Marnix Tack - CTO & VP Business Development at BelGaN will deliver a presentation on "BelGaN – Moving to The Next Chapter". Started early 2022 as a new GaN-focused foundry at the heart of Europe, BelGaN announced early August 2023 the production-release of its 1st generation 650V eGaN technology, preparing for ramp-up by end 2023. Meanwhile BelGaN also launched GaN-ValleyTM, grouping over 40 members in a European ecosystem of Academia and Industry along the GaN value chain, to accelerate innovation and scale-up of a GaN industry in Europe and beyond, towards a sustainable electrified future, aligned with the European ambitions of ChipsAct and Green Deal. Exciting times at rocket speed! The presentation will walk through the journey of bringing up BelGaN technology at record speed and will describe status and offering, with a view on the roadmap. It will outline various differentiated services that BelGaN offers to its customers: (1) harvesting innovation (‘Lab-to-Fab’); (2) bringing high quality to our customers’ customers (‘virtual IDM model’), (3) GaN chip design services. Finally, it will give an update on the GaN-ValleyTM status and ambitions. ⭐️ Registration is still open: https://lnkd.in/dhjcrD7a 💥 Key companies in attendance include: Volkswagen Group, Škoda Group, Renault Group, Volvo Group, onsemi, ZF Group, Vitesco Technologies, Ferrari, Wolfspeed, STMicroelectronics, Bosch, KLA, Innoscience, Efficient Power Conversion, Hitachi Energy and many more... #ISESEUPOWER2023 #SemiconductorEvent #WBGPowerSemiconductors #AutomotiveApplications #SemiconductorIndustry #Innovation #SiC #GaN
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Sales Director @ ATL Electronics | New Business Development, Analog Semiconductors, Wireless Technolog. Help HW/SW Engineers over their New Designs.
European Semiconductor Equipment Supplier's Ecosystem. EQUIPMENT SUPPLIERS THRIVE DESPITE EUROPE’S FALLING CHIP SHARE Capital expenditure for chip manufacturing in Europe has increased strongly since 2021. But Europe’s share of worldwide production capacity in square meters of substrate is still falling. Europe has a lot of work to do to increase its share of manufacturing as other regions ramp up their investments. The EU Chips Act – modelled after US policy to establish a domestic supply chain – will attract more investment in leading-edge manufacturing technology, but it will not significantly increase Europe’s market share. However, European equipment suppliers excel in high-growth specialty markets. Equipment suppliers in the EMEA region accounted for 27% of all semiconductor manufacturing equipment—WFE, assembly, and testing—in 2023. US-based firms KLA , Lam Research, and Applied Materials own multiple WFE suppliers, which if included increase the region’s market share to 31%. Great information from Yole Intelligence. #interesting #technology #semiconductors #ai #innovation ASML Solvay ASM AIXTRON SE Semilab Zrt IMS Nanofabrication GmbH SUSS MicroTec Busch Vacuum Solutions LAUDA Semilab Zrt Nova Ltd. Hiden Analytical Semco Maritime Air Liquide LEVITRONIX TOFWERK Spacetek Technology AG INFICON Meopta s.r.o. JENOPTIK Leybold centrotherm clean solutions GmbH isel Germany GmbH Adenso Pfeiffer Vacuum Bronkhorst Prodrive Technologies VDL ETG Eindhoven
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The term "Advanced Packaging" undersells the area. You'd be forgiven for thinking "I'm not interested in semiconductor packaging, so advanced packaging is definitely not relevant to me". But I'd ask you to delve a bit deeper. Advanced packaging enables intimate integration of very different layers into a single package - for example a photonic layer with a microelectronic layer - even microfluidics. Not only is it super-flexible, but it comes at a much lower price-point than conventional chip development - to the point where it is in reach of research scientists at universities - where it could stimulate some incredible new experimental and prototype devices.
INVITATION - Advanced Chip Packaging Seminar hosted by Semiconductor Sector Service Bureau (S3B) and the Advanced Manufacturing Research Facility (AMRF) as part of the Western Parkland City Authority Interested in learning about the proposed capabilities at AMRF, ahead of the launch of Building 2? Join us on Thursday 6 June at Cicada Innovations, Eveleigh for a seminar and networking opportunity. During the seminar, we will hear from a team of experts to define advanced chip packaging so we can move forward with a shared vision and understanding of the proposed capabilities at AMRF. Our panel of experts includes: Ben Kitcher, Robert, Wei-Chung Lo, Simon Ruffell, Tara Hamilton, Xiaoke Yi, Chris Escott, Madhu Jambunathan MBA and Nadia Court. View the full agenda and register for the event here: https://lnkd.in/gjvJCF2n Please note, while the seminar will not be live-streamed, a recording of the event will be circulated to all who register.
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🚀In June, we will be actively participating in the 2024 Leti Innovation Days organized on 25-27th June by the CEA-Leti in Grenoble, the home of the French “Silicon Valley”. Emmanuel Sabonnadière, EVP for Automotive & Industrial will speak during one of the plenary sessions on the advancements and opportunities that SmartSiC™ brings to #EVs as we ramp up production in our new fab in Bernin! For the past 30 years, we have been at the forefront of designing and manufacturing #semiconductor engineered substrates. By 2030, it is projected that over 45 million cars sold will be EVs and that 50% of them will integrate Silicon Carbide (SiC) into their power electronics. 🔋Our SmartSiC™ engineered substrates represents a new generation of SiC wafers, enhancing the electrical performance and efficiency of power devices, offering a greener, faster, and superior solution by reducing CO2 emissions by 70% , accelerating the adoption of 200mm SiC wafers by 2-3 years and improving device-specific on-resistance by up to 30%. We are looking forward to participate join the #semiconductor industry professionals at this three-day global event! Register here 👉 https://lnkd.in/dJk9Rfpj
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PARTNERSHIPS: #ESCAPE project presents research on #SiC power electronics supply chain The ESCAPE project, a £20m (US$25m) consortium focused on developing an end-to-end #supplychain for silicon carbide (#SiC) power electronics, showcased its findings at a demonstration event last week at the Compound Semiconductor Applications (CSA) Catapult (CSA-C) in Newport, Wales. The project's partners include McLaren Applied Technologies, Clas-SiC Wafer Fab Ltd, Compound Semiconductor Applications (CSA) Catapult, the University of Warwick, and others. Gunwant Dhadyalla, director of AESIN, said, "The project partners have achieved a huge amount and accelerated the supply chain capabilities in the UK for SiC. #AESIN is proud to be working with industry partners and be able to contribute to shaping the future of this transformative #technology.” Joseph Dobson, project delivery lead at the Advanced Propulsion Centre UK (APC), added, "The ESCAPE project was established to create an end-to-end silicon carbide power electronics supply chain in the UK. The work that the partners have completed throughout the project has laid the foundation for a thriving, strategically important sector where the UK can carve out a global niche. There is an exciting opportunity for next-stage projects to build upon this, further solidifying the UK as a leader in high-performance power electronics." Read more here: https://lnkd.in/ewr5XDF2 #motorsportengineering #PMWExpo #motorsport #technology
ESCAPE project presents research on SiC power electronics supply chain
https://www.pmw-magazine.com
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Supporting Leaders in Semiconductors & MEMS to COLLABORATE through the International Semiconductor Executive Summits & MEMS World Summit
Greetings from Oudenaarde, Belgium from the BelGaN FAB! The GaN Foundry in the heart of GaN Valley. Both myself & Dr. Marnix Tack CTO of BelGan have had concise discussions in creating a dedicated community for GaN players. A Partnership announcement will be made during the International Semiconductor Executive Summits Power EU event in Italy, Lake Maggiore on September 14-15 (announced on day 2 on the dedicated GaN day). The GaN agenda can be seen here: https://lnkd.in/dMkrfRGC Key highlights of BelGan: Manufacturing Facility: Wafer fab with over 4500 m2 of clean room space, located on a 44.000 m2campus. Fab: 6 & 8 inch (planned) Production: GaN Technologies & 0.35 µm to 2 µm Low, Medium, and High Voltage Analog CMOS and BCD Technologies For those who don't know BelGaN, they are a WBG foundry in Europe, enabling and providing services to a rapidly expanding GaN-ecosystem in Europe (‘GaN-Valley’) and beyond with innovative and high-quality WBG semiconductor technologies and a highly efficient value-add 6 and 8 inch manufacturing facility. BelGaN adds unique services such as customer-driven Technology-as-a-Service (customized processes), Manufacturing-as-a-Service, and Quality-as-a-Service to the traditional foundry business model whereas we cooperate with suppliers and customers to deliver automotive quality products to the market. BelGaN develops and bring-to-market a rich roadmap of GaN & SiC platforms, driven by their global customers’ needs and their core strengths and vision. They partner with leading universities and RTO’s in an Open Innovation model to prepare our innovation roadmap and bring differentiating innovations to their customers.
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#ESCAPE project presents research on #SiC power electronics supply chain The ESCAPE project, a £20m (US$25m) consortium focused on developing an end-to-end #supplychain for silicon carbide (#SiC) power electronics, showcased its findings at a demonstration event last week at the Compound Semiconductor Applications (CSA) Catapult (CSA-C) in Newport, Wales. The project's partners include McLaren Applied Technologies, Clas-SiC Wafer Fab Ltd, Compound Semiconductor Applications (CSA) Catapult, the University of Warwick, and others. Gunwant Dhadyalla, director of AESIN, said, "The project partners have achieved a huge amount and accelerated the supply chain capabilities in the UK for SiC. #AESIN is proud to be working with industry partners and be able to contribute to shaping the future of this transformative hashtag #technology.” Joseph Dobson, project delivery lead at the Advanced Propulsion Centre UK (APC), added, "The ESCAPE project was established to create an end-to-end silicon carbide power electronics supply chain in the UK. The work that the partners have completed throughout the project has laid the foundation for a thriving, strategically important sector where the UK can carve out a global niche. There is an exciting opportunity for next-stage projects to build upon this, further solidifying the UK as a leader in high-performance power electronics." Read more here: https://lnkd.in/ewr5XDF2 #motorsportengineering #PMWExpo #motorsport #technology
ESCAPE project presents research on SiC power electronics supply chain | Professional Motorsport World
https://www.pmw-magazine.com
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⏰ SEMICON Korea 2024 - one week to go! ⏰ As the countdown begins, we are thrilled to share what SEMICON Korea stands for and to announce our participation as an exhibitor. 🙌 🌍 SEMICON Korea stands at the forefront of the semiconductor industry, bringing together global leaders, experts, and innovators to explore the latest advancements and trends. It serves as a pivotal platform for networking, knowledge exchange, and collaboration, driving the industry towards a brighter, more sustainable future. 🌿 DAS Environmental Experts is proud to be a part of this remarkable gathering. We are excited to showcase our expertise: 1️⃣ Environmental Solutions: Our commitment to sustainability and eco-friendly practices is at the core of our solutions. We are dedicated to providing environmentally responsible options for the semiconductor industry. 2️⃣ VOC Reduction: minimizing or eliminating Volatile Organic Compounds (VOCs) from various sources to reduce their emission into the atmosphere 3️⃣ PFC Reduction: refers to efforts aimed at minimizing or eliminating the emission of Perfluorinated Compounds (PFCs) into the environment 4️⃣ Dust Reduction: Particulate matter plays an important role in industry, not only in occupational health and safety: In the context of industrial processes, exhaust gases generated must be reliably and the particulate matter contained must be safely separated. 5️⃣ NOx Reduction: Dealing with harmful NOx, which is generated in combustion processes, is a real challenge in many industries. DAS Environmental Expert has developed a turnkey solution for NOx treatment, suited for semiconductor and other industries. Don't miss the opportunity to connect with our experts and learn more about our innovative solutions. Visit us at Booth C500. Our team will be there to answer your questions and discuss how our expertise can benefit your semiconductor manufacturing processes. We can't wait to see you at SEMICON Korea 2024! Let's shape the future of the semiconductor industry together. 🚀 #SEMICONKorea2024 #Semiconductor #Environment #Innovation #EnvironmentalSustainability #InnovationInSemiconductors #SemiconductorIndustry #Technology #CleanerTech #SustainableSolutions #Semi
SEMICON Korea 2024 … 31.01.–02.02.2024 | DAS
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🇨🇳 The International Semiconductor Executive Summits CHINA, a prestigious event for senior executives, happening on October 17-18 in the dynamic city of Shanghai. Day 1️⃣ , will dive deep into "CHIPLET LEADING THE CHANGE IN THE NEXT CHIP ECOSYSTEM ," where cutting-edge discussions will reveal the revolutionary potential of chiplet technology. Day 2️⃣ , will focus turns towards the future of automotive technology with "OPPORTUNITIES FOR WBG POWER SEMICONDUCTOR IN AUTOMOTIVE APPLICATIONS ." This session will explore the immense possibilities that wide-bandgap power semiconductors bring to the automotive sector, fueling advancements in electric vehicles, power management, and more. 🙌 The International Semiconductor Executive Summits - CHINA Welcomes Bronze Sponsor: Atotech an MKS Brand, a brand within the Materials Solutions Division of MKS Instruments, develops leading process and manufacturing technologies for advanced surface modification, electroless and electrolytic plating, and surface finishing. Applying a comprehensive systems-and-solutions approach, Atotech’s portfolio includes chemistry, equipment, software, and services for innovative and high-technology applications. These solutions are used in a wide variety of end-markets, including datacenter, consumer electronics and communications infrastructure, as well as in numerous industrial and consumer applications such as automotive, heavy machinery, and household appliances. With its well-established innovative strength and industry-leading global TechCenter network, MKS delivers pioneering solutions through its Atotech brand – combined with unparalleled on-site support for customers worldwide. For more information about Atotech, please visit at atotech.com 💥 Key companies in attendance include: STMicroelectronics, Infineon Technologies, Anhui YOFC Advanced Semiconductor Co., Ltd., Bosch, Hitachi Energy, ZF Group AG, Fast SiC Semiconductor Inc., onsemi,VisIC Technologies Ltd., Resonac, Yole Group and many more… ⭐ Registration is now open: https://lnkd.in/d-79qXfQ #ISESCHINA2023 #SemiconductorEvent #Advancedpackaging #Chiplet #WBGPowerSemiconductors #AutomotiveApplications #SemiconductorIndustry #Innovation #SiC #GaN
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