"The programme started with 20 companies in May endorsing the idea and is holding its second Automotive Chiplet Conference next week with 40 companies and six OEMs.
“We are still looking to form an alliance, it’s a group of companies that are coming together,” he said. “This will create a more resilient ecosystem with multiple players able to add their IP to future chiplets but this will need a future standard. We need to agree as an industry on the interconnect, such as UCIe and BoW but at imec we believe we should agree on protocols, form factors, diagnostics and functional safety.”
“The big challenges are to meet automotive reliability and quality. We need to have a serious conversation about whether that standard is still applicable. It’s now a very different mission profile to what AECQ200 was designed for and we need to make sure we meet the automotive requirements for safety and quality but doesn’t result in chiplets that are twice the size they need to be. These are the kinds of things we are thinking about,” he said.
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