Bart Lemmen’s Post

High numerical aperture (NA) extreme ultraviolet (EUV) lithography represents the next phase for chip production. While it does present its share of challenges, High NA EUV is changing the ecosystem as we know it. Learn more. ⬇

A very good video from one of the best semiconductor industry related content creators. In some ways, it summarizes the high level of complexity (or shall we say insanity ?) needed to keep Moore's law going. Indeed quite some interesting points were raised. Not to mention the timing of this video's release. Just as China has announced that they would use an accelerator for EUV Lithography, it makes me wonder if FELs with their current state of the art might be a viable solution after all. However, the idea of multiple lithography machines on multiple beamlines still seems unnecessarily complicated, considering the near impossible reliability requirements for the FEL and also the difficulty in actually splitting the EUV beams. Moreover, there is now a whole supplier ecosystem built around the Tin Droplet EUV source. It might hence not make commercial sense for the stakeholders to change direction anytime soon. Perhaps laser driven table-top accelerators might hold the key to the future and help achieve an elegant, cost-effective solution. Exciting times ahead for all involved in EUV lithography. #EUVLithography #Lithography #SemiconductorManufacturing #ASML #ZeissSMT #Asianometry https://lnkd.in/eX7gDg3t

Our paper on a 3D simulation tool based on circuit breakers for h-BN memristors has been published in Materials Horizons, https://lnkd.in/dmMz6wCT See here a video with the description of the device fabrication process, the simulator features and the main results. https://lnkd.in/dRfrzTSu The 3D simulator allows to analyze the creation and rupture of conductive filaments in h-BN memristors. The particularities of 2D materials are considered, along with quantum effects, the series resistance, etc. 

John Robinson, KLA senior principal scientist and fellow, shares some thoughts about this year’s SPIE Advanced Lithography + Patterning Symposium and how the annual event advances progress in the semiconductor industry. Read our Q&A with John. #SPIELitho #KLAatSPIE

#Technology #Thread #Semiconductor #Manufacturing #Tools The Semiconductor Lithography Exposure Tools: 1/ - Jan van Schoot From ASML Has Published An Informative Article In IEEE Electron Devices Magazine (March 2024 Issue). - The Article Is Titled: Exposure Tool Development Toward Advanced EUV Lithography. ---- 2/ - The Attached Image Is From This Article. - Showcases Different Lithography Technologies, Starting With G-Line And I-Line, Progressing Through Krf And Arf, To Arf Immersion, And Finally To The Current State-Of-The-Art EUV (Extreme Ultraviolet) Technology. ---- 3/ - Notable Points In The Technology Include The Transition To Arf Immersion And The Implementation Of EUV Technology, Which Allows For A Much Smaller Feature Size Due To Its Short Wavelength Of 13.5 Nm.   ---- 4/ - Such Articles And Information On Lithography Development Are Particularly Useful For Students And Early Career Professionals Who Wish To Learn More About Where The Lithography Industry Was, Where It Is Now And What The Future Holds. ---- 5/ - You Can Read The Article Here: https://lnkd.in/g77YbeRy ---- #chetanpatil - Chetan Arvind Patil - www.ChetanPatil.in

Ever wondered how EUV lithography works? Probably not. Understanding where the Integrated Circuits (ICs) come from in every piece of technology humans use, now that might be something you have wondered about! Give this a read to learn more about High NA EUV lithography!

Directed Energy Deposition (DED), an additive manufacturing technique is being extensively used in the Aerospace industry. It is one of the most adaptable Additive Manufacturing (AM) methods to date, primarily because of its capability to consolidate large-size complex shape components. GKN Aerospace commissions ‘the world’s largest’ DED Additive Manufacturing cell according to a #MetalAM article. The new installation will enable the production of titanium components up to 5.6 m x 2.5 m in size.In India, #ISRO is expanding its capabilities in the aerospace and 3D printing arena with the purchase of a #Magic800 Directed Energy Deposition (DED) machine according to a #TCT article. The system has a build volume of 1.8 x 1.0 x 1.0 mm. Producing such huge parts is costly and hence it’s important to get them manufactured right in the first go. There are various defects that degrade the quality of parts. These defects are broadly categorized into three parts geometrical, morphological, and microstructural (A Review of the Anomalies in Directed Energy Deposition (DED) Processes & Potential Solutions - Part Quality & Defects). Below is an example of a Directed Energy Deposition (DED) simulation carried out by using AM PravaH. AM PravaH allows users to predict #defects in the products before manufacturing. It can predict defects at a #microscale, #macroscale, or #partscale.

Directed Energy Deposition (DED), an additive manufacturing technique is being extensively used in the Aerospace industry. It is one of the most adaptable Additive Manufacturing (AM) methods to date, primarily because of its capability to consolidate large-size complex shape components. GKN Aerospace commissions ‘the world’s largest’ DED Additive Manufacturing cell according to a #MetalAM article. The new installation will enable the production of titanium components up to 5.6 m x 2.5 m in size. In India, #ISRO is expanding its capabilities in the aerospace and 3D printing arena with the purchase of a #Magic800 Directed Energy Deposition (DED) machine according to a #TCT article. The system has a build volume of 1.8 x 1.0 x 1.0 mm. Producing such huge parts is costly and hence it’s important to get them manufactured right in the first go. There are various defects that degrade the quality of parts. These defects are broadly categorized into three parts geometrical, morphological, and microstructural (A Review of the Anomalies in Directed Energy Deposition (DED) Processes & Potential Solutions - Part Quality & Defects). Below is an example of a Directed Energy Deposition (DED) simulation carried out by using AM PravaH. AM PravaH allows users to predict #defects in the products before manufacturing. It can predict defects at a #microscale, #macroscale, or #partscale. Contact Paanduv Applications at support@paanduv.com for a demo. #am #additivemanufacturing #defects #computational #modeling #simulations #cfd #montecarlo #powder #wire #ded #3dprinting #ampravah https://lnkd.in/d_BdsknW

Engineered to Empower DUV, EUV and Next-Generation Semiconductor Lithography Systems With over 50 years of expertise, we've been delivering "can't-fail" and “Failure is not an option” cables for harsh and vacuum environments, especially partnering with NASA and ESA. Over more than two decades, in collaboration with leading lithography OEMs, we've continually enhanced our cable capabilities to support and drive innovations in lithography. Gore’s custom-configured static and high-flex cables & cable assemblies are designed, engineered and manufactured to meet the lithography industry’s toughest standards for durability, outgassing performance, cleanliness and flexibility. Whether integrated into DUV or the latest EUV process technologies, Gore cables enable fabs increase speeds and output without sacrificing yield. Read more on Gore Cables and Cable Assemblies for Lithography Applications: https://lnkd.in/gH4Kc_3s #GoreSemiconductor #Lithography #DUV #EUV #UltraCleanCables #TogetherImprovingLife

#ML_Enhanced full-flow design guided #Wafer_Defect_Analysis and #Reduction Source : Text & Video : https://lnkd.in/dNTZPpuP : 22 pgs PDF : https://lnkd.in/dSASZjMw) : 02/2022 #Virtual_Metrology: Bridge between the different #Data_Sources [ https://lnkd.in/d_aEWMVG) : 30/06/2023 #TSMC : Strengthening of #Yield_Monitoring_System with #AI : Effectiveness of #Auxiliary_Recognition_Model Reaches #98percent ] [ OPC : OPTICAL PROXIMITY CORRECTION PROBLEM SOLVED (via Curved Linear Musk Making) VIA ILT INVERSE LITHOGRAPHIC TECHNOLOGY WHICH IS DEPENDENT ON COMPUTATIONAL LITHOGRAPHY : ( Manufacturing Aware Design ) by NVIDIA 40x Improvement ( CuLitho : #RTL to #CUDA: A #GPU #Acceleration #Flow for #RTL #Simulation ] { [ https://lnkd.in/dyUha3f3) #RegisterTransferLevel ( #RTL ) #Simulation #Acceleration via #Hardware/ #Software #Process #Migration :  #40X #Improvement ]  [ https://lnkd.in/duwn3x_Z) : Mar 23, 2023 #40X #Accelerating #Computational #Lithography From #RTL to #CUDA: A #GPU #Acceleration #Flow for #RTL #Simulation with Batch Stimulus : #40X #Runtime #SpeedUp 98 photomasks to make an H100 GPU : (500 Nvidia DGX H100 replacing 40,000 CPU) It can produce three to #FiveTimes as many #Photomasks per day, drawing only #5megawatts instead of 35 MW.]}  [ 14 Slides : https://lnkd.in/d6cK2kye) : December 2022 Curvilinear #MPC in #Zero_Time] https://lnkd.in/dMpxkv5k) : 25/02/2020 : #ILT and #Curvilinear_Mask #Designs for #Advanced #Memory #Nodes https://lnkd.in/d2GUETa2) The #Advantages of #Floating_Gate #Technology | Intel https://lnkd.in/dPKwiAUm) #Curvilinear #Masks in #Memory #Designs From #DUV to #EUV, : 02/11/2022 "#EzequielRussell of #Micron makes the case for adopting curvilinear masks to extend #DUV #MultiPatterning, as well as help enable #EUV #Layers with #ImprovedPerformance, in #Advanced #Memory #Designs." https://lnkd.in/dea9ZGk3) : 18 April 2022 Review of #Nanosheet #Metrology opportunities for #Technology #Readiness [ https://lnkd.in/d-n_h9jq) : Feb 21, 2023 #20X #Better : #Fractilia Brings #Stochastics #Metrology to #HVM #Fabs to #Improve #EUV #Patterning #Control and #Yields { https://lnkd.in/dDCyZ9Mp) : 03/05/2023 #Fab #Metrology : #Resolution of #CDSEM : Problems & #Solutions Vladislav Kaplan : https://lnkd.in/dFY-xDw5) : 02/07/2023 #Curvature_Tracing through #Gradients & optimized #Denoise_Filters and an #AI Blind #Self_Denoiser. : https://lnkd.in/dgS_sw7D) : 23/07/2023 #Instant_Segmentation on various #CDSEM #Images without relying on any #Supportive_Filters, even within the flow of #Measurement_Utility https://lnkd.in/dPuFKsQX) : 17/04/2023 "#Comparing the #Performance of the #Classical and #DeepLearning #Denoising #Methods, for #CD #Line, #SNR, and #Resolution #Measurements." #Metrology in #VLSI #FAB "#CDSEM #Measurement on products of #LVTailoring Ver.1.30 Ask- #HHT/ #AMAT/ #KLA partners - ask if they can do it.}