Director of Engineering

About the Company: Our client is a privately held, Global Leader in its field, serving the semiconductor and electrical industries. They are known for a great work culture -- often described as friendly, flexible, family-oriented and fun. They have an exciting opening for a key leader in their organization -- Director of Engineering. This position is based in Louisville, KY area and will provide relocation benefit.

About the Role: This position will be responsible for developing wafer fabrication process, integration flows, and metrology tools for enabling novel devices to be fabricated. This position will work with the engineering, manufacturing, sales, and marketing teams to ensure that products being developed for our Glass Core Technology (GCT) customers meet performance, design, and price requirements, and they can be further fabricated and integrated into the customers’ final products.

Responsibilities:

A) Engineering leadership over GCT technology development and implementation, including:

• Through glass via (TGV) fabrication and filling technologies
• Wafer-based fabrication processes which allow electrical, optical and fluidic interconnects
• Process integration flows that enable novel device fabrication

B) Partner with Sales and Marketing to understand customers' requirements to inform the technology roadmap

C) Collaborate with operations to identify process and production issues to drive continuous improvement solutions

D) Partner with other internal development/product groups to ensure GCT devices work in their applications and integrate to their production & technology roadmaps

E) Create & execute technical project management plans with PMO -- to link up schedules and resources

F) Work jointly with Application Engineering to resolve technical issues during and after customer design in

G) Grow and develop the GCT Engineering team

Qualifications: Master’s Degree or greater in Materials Science, Chemical Engineering, Chemistry, Physics, or related field.

Required Skills:

• Expertise with Glass, Silicon, Semiconductor, or Hard drive wafer process development and integration, qualification and high-volume manufacturing strongly desired.
• Experience with fab equipment including lithography (i-line), PVD, CVD, wet etch, dry etch (RIE), ECD Cu plating, electrical test, and characterization is strongly desired.
• Demonstrated success at developing process flows which integrate process modules (litho, deposition, etch) to deliver new products for customers on time.
• Minimum of 5+ years of Engineering Management experience.
• Experience managing and growing an engineering group.
• Ability to work across functional groups and “lead from the side”

Preferred Skills:

• 10+ years of experience in wafer engineering and fabrication
• Ability to work across functional groups and “lead from the side”

Pay range and compensation package: $180,000-220,000 + Benefits

We are an equality opportunity employer.