“I worked directly with Dr. Wasef and he is an absolute genius; he completed his engineering degree in record time and was a PHD by the time he was in his low 20’s; he is one of the most brilliant engineers I have ever interacted with; any company who hires him, needs to enable him and watch your revenue climb; he’s an absolute asset and wonderful engineer; I highly recommend for any non micromanagement organization that truly wants to disrupt the business world ”
Westford, Massachusetts, United States
Contact Info
2K followers
500+ connections
Westford, Massachusetts, United States
Contact Info
2K followers
500+ connections
About
Highly accomplished and results-oriented Microelectronics Senior Engineering Management…
Experience & Education
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Infinitum
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Licenses & Certifications
Volunteer Experience
Publications
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Evaluation of High Temperature Overmold Compounds for Manufacturing of Laminate Based Leadfree SiP
Proceedings of IMAPS Technical Conference 2003
ANADIGICS evaluated the high temperature capabilities of several overmold compounds that could be used to encapsulate laminate based modules. Five overmold compounds were subjected to conditions specified for MSL 3 and reflowed at a peak temperature of 260 °C. Comparison of pre and post stress electrical tests to determine the change in electrical parameters, and comparison of pre and post stress sonoscan images to determine the change in percent delamination were used to judge the performance…
ANADIGICS evaluated the high temperature capabilities of several overmold compounds that could be used to encapsulate laminate based modules. Five overmold compounds were subjected to conditions specified for MSL 3 and reflowed at a peak temperature of 260 °C. Comparison of pre and post stress electrical tests to determine the change in electrical parameters, and comparison of pre and post stress sonoscan images to determine the change in percent delamination were used to judge the performance of the overmold compounds. Failure analysis was also performed on the modules to look for evidence of solder mask delamination and/or solder extrusion. This paper will show how ANADIGICS has achieved a significant milestone in the leadfree packaging and assembly of laminate based modules, met customer expectations, and exceeded currently standards set by industry for leadfree assembly.
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Fabrication Options for Thin Film Integrated Capacitors
2000 HD International Conference on High-Density Interconnect and Systems Packaging
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Low Defect Anodized Tantalum for Use as Dielectric in High Value Integrated Capacitors
Proceeding for the 5th International Symposium on Low and high Dielectric Constant Material: Material Science, Reliability and Processing Issues
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Thermosonic Gold Wirebonding to Electrolessly-Metallized Copper over Benzocyclobutene
International Journal of Microcircuits and Electronic Packaging; Vol 22 #3, 1999
See publicationThe Researchers have studied the thermosonic wirebonding of copper bond pads plated with Nickel and Gold over BCB.
Patents
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Piezo controlled variable capacitor
Issued US 9,443,657
A variable capacitor structure using calibration plates, dual variable distance calibration plates, and/or interleaving extensions to the calibration plates.
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Courses
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Advanced Electronic Packaging
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Certificate in Electronics Manufacturing
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Chemical Corrosion
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Electrochemical Methods
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Electronic Manufacturing Process
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Engineering & Industrial Statistics
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Integrated Circuit Fabrication Technology
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Microeletronics Fabrication & Materials
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Polymer Theory
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Technical Entrepreneurship
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Languages
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Urdu
Native or bilingual proficiency
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Hindi
Limited working proficiency
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Arabic
Limited working proficiency
Organizations
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Institute of Electrical & Electronic Engineers (IEEE)
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International Microelectronics Assembly & Packaging Society (IMAPS)
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Recommendations received
26 people have recommended M. A.
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