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Trevor Vickers
Thunderbolt Share is a groundbreaking software solution that transforms PC-to-PC interactions. Available with select PCs featuring Thunderbolt 4 or Thunderbolt 5 ports, Thunderbolt™ Share offers responsive screen-sharing and swift file transfers, redefining productivity and flexibility in your workflows. Thunderbolt Share not only enhances the capabilities of Intel's products but also provides substantial benefits to #IntelPartners by improving their product offerings, customer satisfaction, productivity, market reach, and innovative leadership. This technology fosters a more connected and efficient environment, which is crucial in today's fast-paced digital landscape. By leveraging Thunderbolt Share, Intel's partners can significantly enhance their competitive edge and meet the evolving demands of their customers. https://lnkd.in/gDsAjzKR
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Manmeet Wirk
When adding stitching vias to a PCB, strategic placement is crucial. It's essential to position them around the edges of critical components, high-speed signal traces, and ground planes. This ensures effective shielding and enhanced signal integrity. The appropriate size and spacing of stitching vias are chosen based on your application's specific requirements and the PCB's material. #PCBdesign
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Manmeet Wirk
Stitching vias, also known as via stitching, are a crucial design practice for PCBs. By placing a series of vias around the perimeter of a ground plane or signal trace, a continuous conductive path is created, connecting the top and bottom layers of the board. #PCBdesign #viastitching
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Ann Hou
Semiconductor Industrial Breaking News 1. Nvidia GB200 chip is rumored to cost US$70,000, and NVL72 server will exceed US$3 million. 2. Micron, SK Hynix and Samsung sent eight-layer vertically stacked 24GB HBM3E samples to NVIDIA for verification at the end of July, mid-August and early October 2023 respectively. Then in early 2024, Micron and SK Hynix HBM3E had passed NVIDIA's verification and won orders. However, the Samsung HBM3E has not passed verification yet. 3. Micron announced on May 9 that it would be the first to ship key memory products for AI data centers. Micron is the first in the industry to verify and ship 128GB DDR5 RDIMM memory based on a large-capacity 32Gb single DRAM chip, with a speed of up to 5600 MT/s on all mainstream server platforms. 4. The Japanese government predicts that Japan's electricity output will need to grow by 35% to 50% by 2050 due to growing power demand from semiconductor factories and artificial intelligence (AI) data centers. 5. FOXCONN Q1 net profit was US$679.69 million, a year-on-year increase of 72%. 6. The Qatar Investment Authority plans to invest in a semiconductor fund set up by French private equity firm Ardian. 7. Murata releases revolutionary LCT that redefines power supply noise rejection, reduces cost and component count. 8. The Biden administration of the United States announced that under Section 301 of the Trade Act of 1974, it will ban the import of a series of products worth US$18 billion from China, including electric vehicles, lithium batteries, photovoltaic cells, critical minerals, semiconductors, steel and aluminum, port cranes and personal protective equipment. Tariffs are imposed on imported goods to protect American workers and businesses. 9. Google releases sixth-generation TPU chip Trillium. 10. The latest report from SEMI International Semiconductor Industry Association shows that with the increase in sales in the electronic field, stable inventory and increased fab capacity, the global semiconductor manufacturing industry will show signs of improvement in Q1 2024, and industry growth can be expected to be stronger in the second half of 2024. According to the report, as high-performance computing (HPC) chip shipments increase and memory pricing continues to improve, global IC sales will achieve a strong year-on-year growth of 22% in Q1 2024, and are expected to achieve a 22% growth in Q1 2024. Q2 2024 surged 21%. IC inventory levels stabilized in Q1 2024 and are expected to improve Q2. In addition, wafer fab production capacity continues to increase and is expected to exceed 40 million wafers per quarter (based on 300mm wafer equivalent). Capacity grew by 1.2% in Q1 2024 and is expected to grow by 1.4% in Q2 2024. #Nvidia #GB200 #NVL72 #server #Micron #SKHynix #Samsung #24GBHBM3E #Micron #datacenters #DDR5 #Japanese #FOXCONN #French #Ardian #Murata #LCT #Biden #Section301oftheTradeAct #China #electricvehicles #ev #photovoltaiccells #Tariffs #Google #TPU #Trillium
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Cheng Ren Liu
News product line 东芝Toshiba 8T23 / 9T24 / 9T25 WAFER #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle
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ACES Group
Taiwan's Aces Electronics shines in collaboration with Spectra7 at California's DesignCon exhibition! Aces (stock code: 3605) and the U.S. high-performance analog semiconductor product supplier Spectra7 jointly announced their successful development of a new 800Gbps high-speed cable for the North American data center market. This cable, integrated with Spectra7's low-power analog chip technology, was showcased at the DesignCon 2024 exhibition in Santa Clara County, California (DesignCon is a premier conference for engineers worldwide focused on high-speed interconnect and system design). The first-rate performance of the 800Gbps Active Copper Cable (ACC) was demonstrated successfully. During the exhibition, Aces' 800Gbps ACC achieved seamless interoperability with testing equipment from multiple vendors, exhibiting an extremely low bit error rate (BER) within the e-9 to e-13 range. This breakthrough technology promises to deliver more efficient and reliable connectivity solutions for the North American data center market. The product highlights include: (1) 800Gbps Speed: This high-speed cable boasts remarkable transmission speeds, suitable for high-demand applications in large enterprises and OEM/ODM factories. (2) Low-Power Analog Technology: Featuring Spectra7's GaugeChanger™ chip technology, it achieves high-speed transmission while reducing power consumption. (3) Active Copper Cable (ACC): This high-speed cable provides stable and efficient connectivity for data centers, supporting rapid data transmission. Senior Executive Director Fu Dagui, spokesperson for Aces, remarked, "This successful collaboration will further drive the development of North American data centers, providing a stronger infrastructure for data transmission." With the rise of the AI trend in the future, the demand for high-speed transmission continues to escalate. The 800Gbps ACC cable offers advantages such as no need for optoelectronic conversion and fast transmission speed, providing customers with more economical and efficient solutions. Spectra7 CEO Raouf Halim expressed pride in the collaboration with Aces, stating, "We are very proud to collaborate with Aces, utilizing Spectra7's innovative GaugeChanger™ integrated chip to expand the application of 800Gbps ACC solutions and showcase our jointly developed technology at DesignCon 2024." John Mitchell, Chief Marketing Officer, further explained, "Large-scale customers in North America are currently developing next-generation data centers and are particularly interested in the 800Gbps high-speed transmission market, with deployments expected to begin in 2024." https://lnkd.in/gdDyg68E #亞太傑出企業獎 #卓越企業管理獎 #卓越企業領袖獎 #碳競爭力100強 #全球華人愛心獎 #Cable #connector #ACES #ICAN #AI #SDGs #ESG
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Elizabeth Prochaska
🌟 Elevate Your Semiconductor Team with Top Talent! 🌟 Are you in the semiconductor industry and seeking to strengthen your team with top-tier talent? Look no further! Our expert semiconductor direct hire recruiting services with NSOURCE at WGNSTAR are tailored to match your company's unique needs and propel your business to new heights. With a deep understanding of the intricacies of the semiconductor field, we specialize in identifying and attracting highly skilled professionals who possess the technical prowess and innovative mindset necessary to thrive in this dynamic industry. Here's why partnering with NSOURCE for your semiconductor direct hire needs is a game-changer: Industry Expertise: Our team comprises seasoned recruiters with a comprehensive understanding of the semiconductor landscape, enabling us to pinpoint candidates with the precise skills and experience you require. Extensive Network: Leveraging our vast network of industry connections and proprietary database, we access a pool of talent that may not be readily available through traditional channels, ensuring you have access to the best candidates in the market. Tailored Approach: We understand that every company has unique requirements and culture. That's why we take a personalized approach to recruitment, aligning our efforts with your specific goals and values to find candidates who not only possess the right skills but also fit seamlessly into your organization. Efficiency and Timeliness: Time is of the essence in the fast-paced semiconductor industry. Our streamlined recruitment process is designed to deliver results swiftly, allowing you to fill critical positions without delay and maintain your competitive edge. Long-Term Partnerships: We're not just here to fill a vacancy; we're committed to fostering long-term partnerships that drive your success. By understanding your strategic objectives, we can assist in building a robust team that propels your company toward its goals. Don't settle for mediocre talent when you can have the best. Let us be your trusted partner in semiconductor direct hire recruitment, and together, we'll take your team to the next level of excellence. Connect with us today to discuss how we can support your recruitment needs and empower your semiconductor business for sustained growth and innovation. Your success starts with the right people, and we're here to help you find them! #Recruiting #Hiring #NSOURCE #WGNSTAR #Semiconductor #Recruitment #DirectHire #TalentAcquisition #TechIndustry 🚀✨
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Cheng Ren Liu
We are pleased to introduce TSMC 3DFabric™, our comprehensive family of 3D Silicon Stacking and Advanced Packaging Technologies. 3DFabric complements our advanced semiconductor technologies to unleash our customer's innovations. Packaging technologies were once considered just backend processes, almost an inconvenience. Times have changed. Computing workloads have evolved more over the past decade than perhaps the previous four decades. Cloud computing, big data analytics, artificial intelligence (AI), neural network training, AI inferencing, mobile computing on advanced smartphones and even self-driving cars are all pushing the computing envelope. #business #india #china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle
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1 Comment -
方严
#DS18B20+ The DS18B20 digital thermometer provides 9-bit to 12-bit Celsius temperature measurements and has an alarm function with nonvolatile user-programmable upper and lower trigger points. The DS18B20 communicates over a 1-Wire bus that by definition requires only one data line (and ground) for communication with a central microprocessor. In addition, the DS18B20 can derive power directly from the data line (“parasite power”), eliminating the need for an external power supply. Each DS18B20 has a unique 64-bit serial code, which allows multiple DS18B20s to function on the same 1-Wire bus. Thus, it is simple to use one microprocessor to control many DS18B20s distributed over a large area. Applications that can benefit from this feature include HVAC environmental controls, temperature monitoring systems inside buildings, equipment, or machinery, and process monitoring and control systems. Applications ● Thermostatic Controls ● Industrial Systems ● Consumer Products ● Thermometers ● Thermally Sensitive Systems ● Unique 1-Wire® Interface Requires Only One Port Pin for Communication ● Reduce Component Count with Integrated Temperature Sensor and EEPROM • Measures Temperatures from -55°C to +125°C (-67°F to +257°F) • ±0.5°C Accuracy from -10°C to +85°C • Programmable Resolution from 9 Bits to 12 Bits • No External Components Required ● Parasitic Power Mode Requires Only 2 Pins for Operation (DQ and GND) ● Simplifies Distributed Temperature-Sensing Applications with Multidrop Capability • Each Device Has a Unique 64-Bit Serial Code Stored in On-Board ROM ● Flexible User-Definable Nonvolatile (NV) Alarm Settings with Alarm Search Command Identifies Devices with Temperatures Outside Programmed Limits ● Available in 8-Pin SO (150 mils), 8-Pin μSOP, and 3-Pin TO-92 Packages
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方严
#DS18B20+ The DS18B20 digital thermometer provides 9-bit to 12-bit Celsius temperature measurements and has an alarm function with nonvolatile user-programmable upper and lower trigger points. The DS18B20 communicates over a 1-Wire bus that by definition requires only one data line (and ground) for communication with a central microprocessor. In addition, the DS18B20 can derive power directly from the data line (“parasite power”), eliminating the need for an external power supply. Each DS18B20 has a unique 64-bit serial code, which allows multiple DS18B20s to function on the same 1-Wire bus. Thus, it is simple to use one microprocessor to control many DS18B20s distributed over a large area. Applications that can benefit from this feature include HVAC environmental controls, temperature monitoring systems inside buildings, equipment, or machinery, and process monitoring and control systems. Applications ● Thermostatic Controls ● Industrial Systems ● Consumer Products ● Thermometers ● Thermally Sensitive Systems ● Unique 1-Wire® Interface Requires Only One Port Pin for Communication ● Reduce Component Count with Integrated Temperature Sensor and EEPROM • Measures Temperatures from -55°C to +125°C (-67°F to +257°F) • ±0.5°C Accuracy from -10°C to +85°C • Programmable Resolution from 9 Bits to 12 Bits • No External Components Required ● Parasitic Power Mode Requires Only 2 Pins for Operation (DQ and GND) ● Simplifies Distributed Temperature-Sensing Applications with Multidrop Capability • Each Device Has a Unique 64-Bit Serial Code Stored in On-Board ROM ● Flexible User-Definable Nonvolatile (NV) Alarm Settings with Alarm Search Command Identifies Devices with Temperatures Outside Programmed Limits ● Available in 8-Pin SO (150 mils), 8-Pin μSOP, and 3-Pin TO-92 Packages
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Transphorm Inc.
We partnered with Weltrend Semiconductor, Inc. to release two new GaN System-in-Packages (SiPs) that, when combined with Weltrend’s flagship GaN SiP announced last year, will establish the first SiP product family based on Transphorm’s SuperGaN® platform. The devices pair with USB PD or programmable power adapter controllers to provide a total adapter solution, offering several innovative features that allow customers to design high quality power supplies faster and with fewer components using the simplest design approach. “SiPs are an important device option when considering the needs of adapter and charger manufacturers. These systems require effective power conversion that [minimize] learning curves to ensure quick design in. The first device released validated the performance and versatility of a SuperGaN SiP. The new devices announced today validate both our companies’ deepening commitment to arming customers with choice,” said Tushar Dhayagude, VP of Worldwide Sales and FAE at Transphorm. Read the full announcement to see how we’re delivering unparalleled performance advantages for devices ranging from 30 W to nearly 200 W: https://lnkd.in/gXZ4WXvW #TGAN #GaN #GalliumNitride #WBG #Semiconductor #PowerSupply #Innovation #Technology #PowerSupply
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Theodore Aggelopoulos, MBA
At Computex 2024, MediaTek, showcased their extensive capabilities. While big companies typically unveil new products at keynotes, MediaTek focused on partnerships and overall strength. CEO Rick Tsai highlighted their Dimensity smartphone chips and lesser-known expertise in compute, wireless connectivity, and other crucial technologies. The most captivating part of the presentation featured on-stage discussions with CEOs from key partners, Arm and Nvidia. Though no new products were announced, these conversations emphasized the interconnectedness of the tech industry and supply chain. The long-standing partnership with Arm was discussed, highlighting MediaTek's role in bringing Arm's technology to market quickly. Discussions with Nvidia covered their existing collaboration in automotive technology and hinted at potential future projects in cloud AI products. By showcasing partnerships and diverse capabilities, MediaTek presented themselves as a crucial player in the tech industry, even if they aren't always the center of attention. #computex2024 #mediatek #chips #chipmaker #techgiants #announcements #partnerships #arm #nvidia #technology #technologynews
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Theodore Aggelopoulos, MBA
Qualcomm's Snapdragon X series is expanding rapidly, with the company now hinting at the development of at least five more chipsets. While officially, Qualcomm has announced five variants, including the X1P-64-100 and four Snapdragon X Elite chips, speculations arise regarding additional Snapdragon X Plus options and an intriguing 'SD1' variant with 80 CPU cores. The Adreno GPU driver files provide a sneak peek into what's coming next. Among the rumored chipsets are the X1E-76-100, a counterpart to the X1E-78-100, showcasing 12 CPU cores. Additionally, development references to X1P-40-100, X1P-42-100, X1P-56-100, and X1P-62-100 with 10 CPU cores hint at a diverse lineup in the works. While the current wave of Snapdragon X series devices is already hitting the market, the anticipation builds for these upcoming chipsets. #Qualcomm #Techgiants #chipmaker #Snapdragon #SnapdragonXElite #Chipsets #SoC #Innovation #hardware #computerhardware #laptops #semiconductors #semiconductorindustry #semiconductormanufacturing #consumerelectronics
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TechCon SoCal
With 2 days to go to the largest gathering of investors, innovators, and entrepreneurs in Southern California, excitement is brewing for Sameer Wasson's keynote session, "IP as the Catalyst for Future Semiconductor Growth," at TechCon SoCal. As the CEO of MIPS, Wasson is poised to deliver valuable insights into the role of intellectual property (IP) in driving innovation and growth within the semiconductor industry. Attendees can anticipate an engaging exploration of how IP strategies are shaping the future landscape of semiconductor technologies. In the current landscape of semiconductor development, Wasson will shed light on the pivotal role that intellectual property plays as a catalyst for innovation and growth. With the semiconductor industry experiencing rapid evolution and increasing competition, effective IP strategies are essential for companies to differentiate themselves and stay ahead of the curve. Wasson's session promises to provide valuable perspectives on how leveraging IP assets can fuel advancements in semiconductor technologies and propel industry growth in the years to come. Reflecting on the past, Wasson will trace the historical significance of intellectual property in shaping the trajectory of the semiconductor industry. From the early days of semiconductor innovation to the present era of complex microprocessor designs and advanced semiconductor architectures, IP has been a driving force behind technological progress. Wasson's retrospective analysis will offer insights into key milestones and challenges in the intersection of IP and semiconductor development, providing attendees with a deeper understanding of the industry's evolution. Get ready to uncover the power of IP in semiconductor growth – don't miss Wasson's keynote at TechCon SoCal! OPEN Silicon Valley TIE San Diego Interlock Capital Orange County OC Startup Council The Brink SBDC EvoNexus UC San Diego SDSU College of Sciences Pismo Ventures Cross Ocean Ventures Startup Steroid - Deal Flow | SPVs | Demo Day Platform Alliance for Southern California Innovation Spark Growth Ventures SoCal Startup Day Reflect Ventures Wharton Alumni Angels NuFund Venture Group Flok Labx Ventures Mercury Pankaj Kedia Serhat Pala Neal Bloom David Saxton Cheryl K Goodman Ellen M. Chang Niraj Desai Akash Pai Sufyan Subzwari Jonah Peake 🐺 Ella Napata Stephen Silver Fred Grier Scott Fox 🦊 Atlás Blake Eric Eide #TechconSoCal2024 #IndustryExperts #TechConference #InnovationSummit #TechTalks #startupsteroid #innovations #technologynews #networking #artificialintelligence #digitalhealth #robotics #startups #AngelInvestors #vc #SandDiegoStartup #founders #consumertech
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Marco Mezger
SK hynix: #GDDR7 Mass Production To Start in Q1'2025 Being a major JEDEC #memory standard, GDDR7 is slated to be produced by all three of the Big Three memory #manufacturers. But it seems that not all three vendors will be kicking off mass production at the same time. #SKhynix was at this year's #Computex trade show, showing off their full lineup of memory #technologies – including, of course, GDDR7. SK hynix is the last of the major memory vendor's we've seen promoting their memory, and fittingly, they seem to be the last in terms of their mass production schedule. According to company representatives at the show, the firm will not kick off mass production of their GDDR7 chips until the first quarter of 2025. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eEMBgD_N #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #ai #semiconductormanufacturing #dram #mobile #it
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Philip Zuk
Transphorm GaN technology offers the most flexibility in power electronics. This is the result its ease of design, which is one of the cornerstones of our technology. Our SuperGaN FETs compete directly against silicon, silicon carbide, and e-mode GaN whether it’s how the device is driven or the package(s) it’s offered in. Up and above SuperGaN’s flexibility we also enable our SIP (System-In-Package) partners such as Weltrend with GaN FET solutions that compliment our discrete offerings. This results in a solution for all customers no matter their architecture or system needs. #supergan #gan #transphorm #reliability #Weltrend
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Marco Mezger
SK hynix reports record Q1 with soaring demand for #HBM #chips #SKhynix saw first 2024 quarter revenues soar 144 percent as demand for high-bandwidth memory (HBM) chips rocketed. The #DRAM and #NAND manufacturer reported ₩12.43 trillion ($9.03 billion) in revenues with a ₩1.92 trillion ($1.4 billion) profit compared to last year’s ₩2.6 trillion ($1.9 billion) loss. This was a record first quarter revenue amount. DRAM accounted for 61 percent of its revenue and NAND 35 percent, with the remainder coming from other activities. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejUBVCMT #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #ai #artificialintelligence #semiconductormanufacturing #chips
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Saket Thukral
After ~6 years at Knowles Corporation, it's bittersweet that this week will be my last week here. Back in 2018, I took a big chance leaving a solid career track at Qualcomm and the city of San Diego to come join Knowles in the Chicagoland area. My thesis at the time was that I could learn more and drive impact faster working for a smaller, nimbler business. Looking back at the last few years, I am glad to say that it turned out to be as I had anticipated. After working for 15+ years at giants like Texas Instruments and Qualcomm, working for a much smaller company took some adjustment. Processes and resources one takes for granted at these large companies are either non-existent or rudimentary by comparison. On a positive front, one gets to see the inner workings of a business and its interplay with corporate objectives with much more clarity and intimacy. With this new perspective, I found the entrepreneur in me. I became comfortable with taking calculated risks across all areas of business and technology, learned how to deploy meager resources for major outcomes, and, above all, that sometimes, not doing anything is better value than driving action for the sake of action. Greg Doll, my manager from the start to the end, has been more of a big brother and a partner than a boss to me and together we helped navigate the business through some of the most challenging times ever, especially during and post-COVID. The level of autonomy and trust I got from him allowed me to be me and decisively do what I thought was best for the business. Jeffrey Niew, our CEO, encouraged me to speak my mind, especially when I was the one with a contrarian view, which gave me the confidence to be bold about raising difficult topics and defining well-thought-out strategies. We both enjoy respectful debates and through the back and forth, I learned a lot about how to flesh out complex subjects and simplify decision-making. I consider him a mentor and myself lucky to have been able to spend so much time with him. The WW Knowles operations teams, you are world-class! The dedication with which you problem-solve is truly inspirational. It's been countless times that you have had to come to save the day, be it to fulfill short-fuse orders, overcome a quality excursion, or any one of the countless other hiccups that happen in a complex operation like ours. My thanks also to the other colleagues at Knowles who helped execute our strategy by creating and deploying winning products, including the flagship V2S product line that we launched last year after years of perseverance. An acknowledgment of the leaders on my team, Raghav Kamath, Nikolay Skovorodnikov, Nathaniel Maercklein, and Luca Bettini. Each one of you is a class act. It has been an honor leading you and helping you grow in whatever way I could. Given your trajectories, it'll be an even bigger honor for me to work for you someday. Customers/partners - thank you for your partnership and goodwill!
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Stella Cheng
【Industry news】 #Samsung is rumored to stop #autonomous #driving #research and shift its personnel to the field of #robotics #Apple has withdrawn from the #development of #self-driving #electric cars after 10 years, and #Samsung Electronics has also suspended research on self-driving car algorithms (#software), planning to focus on #robot research and conduct future robot research including #humanoid #robots. Samsung Research Institute is an advanced research and development (R&D) institution under the #Device #Experience (DX) Department. It currently does not conduct research related to #autonomous #driving, so this decision actually stopped research on autonomous driving.
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