James Gallagher

NY senator breaks a spoiler to AP: Micron Technology to receive $6.1B from the Chips Act. Excerpts from Boise (Idaho) Development : "Micron Technology will get $6.1 billion from the CHIPS Act to fund large-scale expansions in Boise and Syracuse, NY. ... Micron has started work on a $15-billion expansion of its Boise campus, which would add significant new research and development capacity to the site off Federal Way. The City of Boise annexed nearly a square mile of new land for Micron, and work has begun on initial infrastructure. The Boise expansion would add nearly 2,000 local jobs, the company said. ... In addition to the federal funds, Micron will get incentives from the State of Idaho as well as some non-direct assistance from the City of Boise, as BoiseDev previously reported. ... Micron will also build a nearly $100-million facility near Syracuse, New York, which Schumer said to the AP is the largest single investment in that state since the Erie Canal. ... Schumer told Syracuse.com that the deal was preliminary and non-binding and could be announced next week. ... Correction: A prior version of this story incorrectly stated that the reported mount was $5.1 billion. It is $6.1 billion." https://lnkd.in/gCByqhnb

5

1 Comment

Efficient Power Conversion Corp (EPC), headquartered in El Segundo, CA, specializes in gallium nitride on silicon (eGaN) power FETs and integrated circuits for power management applications, with recent validation of their GaN intellectual property rights by the US International Trade Commission (ITC). The ITC upheld EPC's patents and found Innoscience Technology Co Ltd guilty of infringing EPC’s foundational patent, potentially leading to a ban on importing their products into the USA. This ruling is a significant validation of nearly two decades of EPC's hard work and research, reflecting the importance of their intellectual property portfolio. The ITC's final determination is expected on November 5. Innoscience EPC - Efficient Power Conversion #semiconductor #intellectualproperty #industry #lawsuit #technology #GaN https://lnkd.in/di792VMW

6

Stitching vias, also known as via stitching, are a crucial design practice for PCBs. By placing a series of vias around the perimeter of a ground plane or signal trace, a continuous conductive path is created, connecting the top and bottom layers of the board. #PCBdesign #viastitching

1

A very interesting pitch indeed. Plasma based process doesn’t typically works in case of HAR and thermal processes require very high temperature unless either catalyzed OR a specifically designed silicon precursor in which the catalytic amine functionality is embedded as a single precursor which still requires an oxidizing coreactant. The drawback is carbon and or nitrogen containing films. The same is true for a pyridine catalyzed reaction. Also, pyridine is a good theoretical example but doesn’t works that well at HAR. Simpler smaller amines works far better. In the end, slow deposition often results in denser films which in turn results in low leakage current and higher breakdown voltage. The reduction in time seems like faster deposition but in reality the deposition step may still be similar or even slower but purge time has been substantially reduced. Sounds like combination of lower dose and smaller volatile catalyst. However, the choice of plasma vs thermal process depends on the desired electrical properties as well. Overall a good read. Thanks for sharing. A clean deposition of oxide at 27 C with better film properties is interesting! #semiconductors #ald #atomiclayerdeposition

5

1 Comment

Gate breakdown is a significant challenge in GaN power semiconductor devices, especially under high-frequency operations. ROHM’s solutions, https://lnkd.in/g4tbs_Vc 1. Addition of Gate Resistors - To mitigate gate overshoot and dampen oscillations during switching. By adding resistors in the gate circuit, ROHM can control the gate drive voltage more precisely, reducing the risk of gate breakdown due to transient spikes. - Advantage: This approach balances the need for fast switching with the protection of the gate structure, ensuring long-term reliability without significantly compromising performance. 2. Robust Gate Structures - To enhance the intrinsic robustness of the gate terminal against high voltage and current stress. ROHM develops proprietary gate designs and fabrication techniques to strengthen the gate terminal, making it more resilient to breakdown. - Advantage: A robust gate structure can handle higher voltages and currents, allowing the device to operate more reliably in demanding applications. 3. Integrated Driver ICs - To optimize the driving conditions and ensure safe operation of the GaN device. ROHM integrates driver ICs with GaN power devices in a single package. These ICs are designed to precisely control the gate voltage and current, preventing over-voltage conditions that could lead to gate breakdown. - Advantage: Integration reduces parasitic inductances and improves switching performance, while also ensuring that the gate is driven within safe limits. Comparison with Other Solutions: Solution-1: Using advanced gate driver technology with adaptive dead-time control and protection features. - Comparison: The adaptive control provides dynamic protection, ROHM’s use of integrated driver ICs in a single package offers a more compact solution with potentially lower parasitic effects. Solution-2: Employing proprietary gate oxide materials and gate drive techniques to enhance robustness. - Comparison: It’s focus on material science complements ROHM's approach, but ROHM’s combination of robust gate structures with integrated driver ICs provides a comprehensive solution that addresses both material and circuit-level challenges. Solution-3: Useing enhancement-mode GaN (eGaN) FETs with optimized gate drive circuitry and packages. - Comparison: Its enhancement-mode GaN devices are highly efficient, but ROHM’s addition of gate resistors and integrated solutions can offer better control and reliability, especially in high-frequency applications. Solution-4: Focusing on wide gate drivers and low inductance packaging to prevent gate breakdown. - Comparison: Its low inductance packaging is similar to ROHM’s integrated approach, but ROHM’s specific use of gate resistors adds an additional layer of protection. ROHM’s solutions provide a balanced and competitive approach.

6

5 Reasons Why Legacy Nodes Remain Crucial in the 1nm Era? Legacy nodes Typically refer to older, well-established fabrication processes, often at 45 nm or 28nm and larger. 🚀 Cost-Effectiveness: Manufacturing chips at advanced nodes like 1nm is expensive due to the complexities involved. Legacy nodes are a better choice for cost-sensitive applications. Imagine building a high-performance gaming PC vs. a basic office computer. The gaming PC (1nm chip) is expensive with all the latest tech. But a basic computer (legacy node) is much cheaper to make, perfect for everyday tasks like browsing the web. 🚀 Power Efficiency: Smaller transistors in advanced nodes enable faster performance but often come at the cost of higher power consumption. Legacy nodes, with their larger transistors, can be more power-efficient, a critical factor for battery-powered devices like smartphones and wearables. Tiny transistors in new chips are like powerful engines in cars - they work great but use a lot of fuel (battery power). Bigger transistors in legacy nodes are like fuel-efficient car engines - they might not be the fastest, but they use less battery, ideal for things like smartphones and smartwatches that need to last all day. 🚀 Maturity and Reliability: Legacy nodes have been around for longer and have undergone extensive refinement, leading to highly optimized and reliable processes. This maturity ensures consistent performance and fewer bugs, crucial for applications demanding stability. Think of a recipe you've made many times. You know exactly how much of each ingredient to use and how long to cook it for. Legacy nodes are like that tried-and-tested recipe - they're reliable and we know how to make them work perfectly for everyday electronics. 🚀 Compatibility: Not all applications require the bleeding-edge performance offered by 1nm chips. Legacy nodes can integrate well with newer technologies, enabling efficient design of complex systems with a mix of performance requirements. Imagine building a house - you might need different materials for the roof, walls, and foundation. Legacy nodes can be like those different materials - they work well with newer technologies to create all sorts of electronic devices, like a phone with a powerful processor (1nm chip) but a low-power Bluetooth chip (legacy node) for connecting to headphones. 🚀 Internet of Things (IoT): The vast and growing world of IoT devices, many of them simple sensors, often doesn't need the processing power of 1nm chips. Legacy nodes are perfectly suited for these low-power, low-cost applications. Tiny sensors in things like fitness trackers or smart thermostats don't need the processing power of a fancy 1nm chip. Legacy nodes are the perfect tool for these smaller jobs, keeping costs low and battery life long. Guess, Which Country is investing huge in legacy Nodes? Tell us in the comments. A detailed post is in comments. For all semiconductor and AI content, follow TechoVedas

78

3 Comments

Hybrid Bonding is a critical enabler of the integrated chiplet architecture, which will become pervasive for high performance semiconductor devices. It is expected that the broad adoption of the Hybrid Bonding technology will enable further scaling in interconnect density (1M/mm2), over the next few years. The combination of high interconnect density with superior performance (electrical, thermal and reliability) makes Hybrid Bonding a compelling technology for advanced semiconductor devices. As the technology further matures and the manufacturing cost decreases over time – enabled by a robust eco-system and integrated cluster tools, it will proliferate from foundries to OSAT’s, for a broad range of products. Front end processes and backend processes will be further integrated, and the boundary between foundries and OSAT’s will be blurred even further over time. The time has come for Hybrid Bonding. This new book, "Direct Copper Interconnection for Advanced Semiconductor Technology", offers a comprehensive review and in-depth discussions of the key topics in the Hybrid Bonding technology. https://lnkd.in/gW8iPQpZ #SemiconductorPackaging #HeterogeneousIntegration #CHIMES #semiconductormanufacturing #semiconductors #semiconductorindustry #semiconductor #advancedpackaging #thermalmanagement #thermalanalysis #thermalengineering #systemintegration #microelectronics #3d #packaging #computing #Chiplets, #SoC, #SiP #chips #TSV and 3D Packaging Technologies #Automotive Electronics Packaging #Semiconductor #advancedmanufacturing

63

6 Comments

How Arizona close the gap for semiconductor workforce Today, semiconductors are the most indispensable commodity around the world. “No product is more central to international trade than semiconductors,” Chris Miller wrote in his 2022 book Chip War: The Fight for the World’s Most Critical Technology. Concern about the U.S.’s decades-long decline in its share of global semiconductor manufacturing has prompted bipartisan action at the highest levels of government. In response, some states have sprung into action. The types of innovations and partnerships taking root in the U.S. are prevalent in Arizona, the state that’s attracted the most semiconductor investment. A Robust Talent Pipeline With its vast expanses of open land, booming population, and minimal natural disasters, the Grand Canyon State offers near-perfect conditions for advanced manufacturing to thrive. It also boasts a robust semiconductor presence, with an established talent pipeline and supply chain. Arizona leads the nation in new semiconductor ecosystem investment, with more than $102 billion announced since the CHIPS Act took effect. During this time, companies have launched over 40 projects, generating more than 15,700 industry jobs. The state uses its networks and education assets to launch its many training programs, such as the Semiconductor Technician Quick Start program, a 10-day, 40-hour boot camp taught by industry professionals. Upon completion, students are guaranteed a job interview at one of the state’s industry leaders, including TSMC and Intel.

2

True nanoscale engineering with selective deposition & etching - stacking atom by atom, molecule be molecule

4

Actually, RAM=Read write Random Access Memory. It is volatile. ROM=Read only Random Access Memory. It is non-volatile. Clearly explained about the above fullforms.This post answers the question "Why RAM is called as Random access memory? " #memories #embeddedsystems #computers #volatileandnonvolatilememories #processors

2

10 Steps to Fabricate a Semiconductor Chip 1. Design and Mask Creation: - The process begins with the design of the semiconductor device. Engineers create a detailed layout specifying the placement and interconnections of transistors, resistors, and other components. - The design is then used to create masks, which are templates that define patterns to be transferred onto the semiconductor wafer during the manufacturing process. 2. Wafer Preparation: - Silicon wafers are used as the substrate for semiconductor devices. The wafers are typically polished and cleaned to remove any impurities. - A thin layer of oxide is grown on the wafer's surface, creating a smooth and uniform starting point for the subsequent process steps. 3. Photolithography: - The masks created earlier are used in a process called photolithography. A layer of photoresist is applied to the wafer, and the mask is placed over it. - The wafer is exposed to light, and the mask's pattern is transferred onto the photoresist. The exposed or unexposed areas are then developed, leaving a pattern on the wafer surface. 4. Etching: - Chemical etching is used to remove material from the wafer where the photoresist has been selectively removed. This step defines the features of the semiconductor device. - Different etching processes are used for different materials (e.g., silicon dioxide, polysilicon, metal layers) to create the desired patterns. 5. Deposition: - Thin films of various materials, such as metal or insulating layers, are deposited onto the wafer surface using techniques like chemical vapor deposition (CVD) or physical vapor deposition (PVD). - These deposited layers create the conductive paths, insulating layers, and other elements of the semiconductor device. 6. Ion Implantation: - This step involves introducing dopant ions into specific regions of the wafer to modify its electrical properties. Ion implantation is crucial for creating the desired transistor characteristics. 7. Annealing: - The wafer undergoes a high-temperature annealing process to activate dopants and repair any damage caused during ion implantation. This step ensures the proper functioning of the fabricated devices. 8. Chemical Mechanical Polishing (CMP): - CMP is used to planarize the wafer surface, creating a smooth and even topography. This is crucial for the proper functioning and reliability of the devices. 9. Metrology and Inspection: - Throughout the fabrication process, various measurements and inspections are conducted to ensure that each step meets the required specifications. This involves using sophisticated tools to check dimensions, layer thickness, and other parameters. 10. Packaging: - Once the fabrication of individual devices on the wafer is complete, the wafer is cut into individual chips. These chips are then packaged, tested, and prepared for distribution and use. #VLSI

733

15 Comments

10 Steps to Fabricate a Semiconductor Chip 1. Design and Mask Creation: - The process begins with the design of the semiconductor device. Engineers create a detailed layout specifying the placement and interconnections of transistors, resistors, and other components. - The design is then used to create masks, which are templates that define patterns to be transferred onto the semiconductor wafer during the manufacturing process. 2. Wafer Preparation: - Silicon wafers are used as the substrate for semiconductor devices. The wafers are typically polished and cleaned to remove any impurities. - A thin layer of oxide is grown on the wafer's surface, creating a smooth and uniform starting point for the subsequent process steps. 3. Photolithography: - The masks created earlier are used in a process called photolithography. A layer of photoresist is applied to the wafer, and the mask is placed over it. - The wafer is exposed to light, and the mask's pattern is transferred onto the photoresist. The exposed or unexposed areas are then developed, leaving a pattern on the wafer surface. 4. Etching: - Chemical etching is used to remove material from the wafer where the photoresist has been selectively removed. This step defines the features of the semiconductor device. - Different etching processes are used for different materials (e.g., silicon dioxide, polysilicon, metal layers) to create the desired patterns. 5. Deposition: - Thin films of various materials, such as metal or insulating layers, are deposited onto the wafer surface using techniques like chemical vapor deposition (CVD) or physical vapor deposition (PVD). - These deposited layers create the conductive paths, insulating layers, and other elements of the semiconductor device. 6. Ion Implantation: - This step involves introducing dopant ions into specific regions of the wafer to modify its electrical properties. Ion implantation is crucial for creating the desired transistor characteristics. 7. Annealing: - The wafer undergoes a high-temperature annealing process to activate dopants and repair any damage caused during ion implantation. This step ensures the proper functioning of the fabricated devices. 8. Chemical Mechanical Polishing (CMP): - CMP is used to planarize the wafer surface, creating a smooth and even topography. This is crucial for the proper functioning and reliability of the devices. 9. Metrology and Inspection: - Throughout the fabrication process, various measurements and inspections are conducted to ensure that each step meets the required specifications. This involves using sophisticated tools to check dimensions, layer thickness, and other parameters. 10. Packaging: - Once the fabrication of individual devices on the wafer is complete, the wafer is cut into individual chips. These chips are then packaged, tested, and prepared for distribution and use. A detailed post is in comments. For all semiconductor and AI, Follow TechoVedas

269

5 Comments

Here's a counterintuitive way to get more done. ✍🏼 Let me know how it works ♻️ Repost if you enjoyed it 🧲 Join 2.4K+ others in my RF engineering newsletter (link in bio/comments)

51

3 Comments

#Technology #Thread #Semiconductor #Manufacturing #Glass The Semiconductor Glass Substrate Investment: 1/ - The U.S. Government Has Announced Preliminary Terms With Absolics, An Affiliate Of SKC, To Provide Up To $75 Million In Funding Under The CHIPS And Science Act. - This Investment Will Support The Construction Of A 120,000 Square-Foot Facility In Covington, Georgia, Creating Over 1,200 Jobs. ---- 2/ - What Will This Facility Will Focus On? - Development Of Advanced Glass Substrates For Semiconductor Packaging. - This Is A Significant Step Towards Speeding Up The Adoption Of Glass Substrate. ---- 3/ - Why Glass Substrate Matters: -- Compared To Today's Organic Substrates, Glass Substrates Offer Ultra-Low Flatness And Superior Thermal And Mechanical Stability Compared To Organic Substrates -- These Properties Enable Much Higher Interconnect Density In A Substrate -- Benefits Include The Creation Of High-Density, High-Performance Chip Packages Suitable For Data-Intensive Workloads Such As AI ---- 4/ - In Short, This Advancement Might Well Also Help Continue Moore's Law Beyond 2030. ---- 5/ - Nevertheless, Several Challenges Line Up For Glass Substrate Adoption, Such As Fragility And Manufacturing Complexity. - Hopefully, The Funding Announcement Will Make Glass Substrates A More Mainstream Solution. ---- #chetanpatil - Chetan Arvind Patil - www.ChetanPatil.in

22

2 Comments

Enabling 2.5D/3D Multi-Die Package Both approaches to integrating multiple #chiplets have unique challenges 💡 In the rapidly evolving world of #ASIC design, the shift from monolithic to 2.5D and 3D multi-die architectures represents a significant leap forward. This approach, which integrates multiple chiplets (also knowns as dies) into a single package, demands not only a new level of #IC design #innovation but also an increased complexity in coordination and integration. At the forefront of this technological revolution is Global Unichip Corp. (GUC), which has effectively harnessed the power of Synopsys Inc’ 3DIC Compiler, a unified exploration-to-signoff platform, to streamline its #chip design processes and reduce overall cycle time. GUC recently presented their multi-die tape-outs at SNUG Silicon Valley 2024, which were made more efficient by Synopsys’ 3DIC Compiler through the implementation of die floorplanning and related bump assignments. 3DIC Compiler helped further check the physical and logical connectivity, sync up information from die to die quickly, and, ultimately, shorten chip design cycle timelines for GUC’s 2.5 and 3D #CoWoS designs. This distinction between 2.5D and 3D IC design approaches becomes critical in addressing the increasing demand for higher performance and more integrated systems. Each method comes with its unique set of challenges and benefits, tailored to specific application needs. Thanks again to Kenneth Larsen and Semiconductor Engineering for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e48EXEFw #semiconductorindustry #semiconductor #foundry #advancedpackaging #technology #icdesign #usa #chip #tech #semiconductormanufacturing

69

2 Comments

The U.S. Gave Chip Makers Billions. Now Comes the Hard Part. Chips Act’s early stages have been challenged by rivals overseas and the sheer expense of making chips https://lnkd.in/gq4PUBsq #chips #semiconductors #semiconductormanufacturing The impact of the program is also limited by the sheer cost of chip plants. A single advanced chip fab can cost more than $20 billion, and the planned U.S. facilities won’t be operating until later this decade. Those realities mean that even a historic $39 billion grant program can’t itself tip the global share significantly in the U.S.’s favor. This is the reality..

7