Brian Thayer

Devices that benefit most from LPDDR4X are those requiring efficient power management and high-speed data processing, such as smartphones, tablets, and other portable or embedded systems. Its low voltage operation and high data rates make it ideal for running advanced applications and handling demanding tasks.

14

PCIe Gen6 + 5nm + MRVL SerDes = Lowest Power for AI!!

37

Check out what we have to say now!

32

Thunderbolt Share is a groundbreaking software solution that transforms PC-to-PC interactions. Available with select PCs featuring Thunderbolt 4 or Thunderbolt 5 ports, Thunderbolt™ Share offers responsive screen-sharing and swift file transfers, redefining productivity and flexibility in your workflows. Thunderbolt Share not only enhances the capabilities of Intel's products but also provides substantial benefits to #IntelPartners by improving their product offerings, customer satisfaction, productivity, market reach, and innovative leadership. This technology fosters a more connected and efficient environment, which is crucial in today's fast-paced digital landscape. By leveraging Thunderbolt Share, Intel's partners can significantly enhance their competitive edge and meet the evolving demands of their customers. https://lnkd.in/gDsAjzKR

15

Micron Technology unveils QLC NAND #SSD with more than 200 layers 💡 #Micron has launched a 2500 QLC NAND internal fit client product that’s faster than its 2550 TLC predecessor, despite TLC #NAND typically being quicker than QLC NAND. TLC (triple level cell) NAND has 3 bits per cell while QLC (quad level cell) has 4 bits per cell, meaning the #SSD's controller has to negotiate QLC’s 16 voltage states per cell instead of 8 with TLC. It takes longer to read and write individual cells unless the controller #firmware gets clever with such things as a very fast SLC (1 bit/cell) cache, and parallel #data plane access. Micron’s 2500 is claimed to be the first 200-plus layer QLC drive for OEM #desktop and #notebook (client) #computers. It uses 232-layer QLC NAND, and this gives it 30 percent more density, Micron says, than its 2400 176-layer QLC product, and 31 percent more than its 232-layer TLC NAND, as used in the 2550 M.2 format SSD. This was launched in December 2022 so it has taken 16 months to add the extra bit to the 232-layer NAND cells used in the 2500. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eqDvqWmQ #semiconductor #semiconductorindustry #semiconductors #technology #tech #informationtechnology #chip #chips #it #computer #memory

127

2 Comments

When adding stitching vias to a PCB, strategic placement is crucial. It's essential to position them around the edges of critical components, high-speed signal traces, and ground planes. This ensures effective shielding and enhanced signal integrity. The appropriate size and spacing of stitching vias are chosen based on your application's specific requirements and the PCB's material. #PCBdesign

5

SK hynix reports record Q1 with soaring demand for #HBM #chips #SKhynix saw first 2024 quarter revenues soar 144 percent as demand for high-bandwidth memory (HBM) chips rocketed. The #DRAM and #NAND manufacturer reported ₩12.43 trillion ($9.03 billion) in revenues with a ₩1.92 trillion ($1.4 billion) profit compared to last year’s ₩2.6 trillion ($1.9 billion) loss. This was a record first quarter revenue amount. DRAM accounted for 61 percent of its revenue and NAND 35 percent, with the remainder coming from other activities. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejUBVCMT #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #ai #artificialintelligence #semiconductormanufacturing #chips

110

2 Comments

Daily News ⑤Intel has a wafer-level assembly problem, hurting Core Ultra sales. "Seasonal client revenue is constrained by wafer level assembly supply, which is impacting our ability to meet demand for our Core Ultra-based AI PCs," Gelsinger said during the earnings call. Gelsinger acknowledged that demand will only intensify with Microsoft's expected update to Windows 11 and AI boom. The sales of AI PC CPUs are predicted to beat 40 million units. ⑥Apple plans to spend more in Vietnam.  According to Retail News Asia, as of FY23, the number of Apple suppliers in Vietnam increased to 35, an increase of 10 from the previous year, ranking fourth globally. Apple CEO Tim Cook recently visited Vietnam and met with Prime Minister Pham Minh Chinh, pledging to ramp up procurement of components from local suppliers and support their innovation. ⑦Murata secures $2.6 billion-worth orders in 24Q1, up 30.8%. Murata Chairman Tsuneo Murata said that the smartphone market has shown a recovery in components shipments with demand growth in lower-end and high-end clients. The company's MLCC utilization rate is expected to rise to 85-90% this year. In addition, Murata received $2.6 billion worth of orders during the first three months this year, soaring by 30.8% from a year earlier. ⑧Desay SV, GAC's Hyper, NVIDIA to co-develop cockpit-driving integrated L4 solutions. On April 26, Desay SV, GAIC AION's Hyper brand, and NVIDIA signed a tripartite cooperation agreement at the Auto China 2024 in Beijing. The trio aims to manufacture L4 production vehicles jointly, providing power support for advanced autonomous driving functions, confident views, digital clusters, and AI-powered cockpits. Hyper plans to mass-produce L4 models by 2025, achieving an industry-leading 2,000 TOPS computing power. #randa #electroniccomponents #semiconductors #ic #cpu #mcu #gpu #chips #autoparts #vehicles #materials #trends #AI #supplychains #Intel #Apple #Murata #Desay #EV #DDR #NVIDIA #procurementstrategies

1

Join this upcoming AMD w ebinar on June 26th: Designing for Versal Adaptive SoCs with AI Engines using Simulink and Vitis Model Composer. This webinar will show an example design – targeting the programmable logic and AI Engines in a Versal AI Edge device, and features speakers from AMD, Avnet, and MathWorks. #TogetherWeAdvance #AdaptiveComputing #Webinar #Versal #Vitis

13

Discover how #NXP is setting the industry-wide standard for dependable, secure #connectivity. This means that devices will function together without any problems, now and in the future. Make sure you look into the key to interoperability!

1

UCIe is crucial for high performance computing. Explore the Cadence UCIe demo to learn about chiplet interconnect features and the future of chiplet technology in SoCs. Watch William G. Wong's interview with Mayank Bhatnagar, Product Marketing Director at Cadence: ⤵️ https://ow.ly/tqYi50S0usa

19

The demand for PCIe 6.0 switches has surged due to the exponential growth in global data traffic. Read how to streamline PCIe 6.0 switch design with effective verification strategies. https://ow.ly/RIxa50S0Uc3

3

Great OFC coverage by LightCounting. TeraSignal’s Intelligent Re-Driver in CMOS is changing the power, reliability and performance calculus between DSP and LPO modules.

25

To overcome the challenges posed by the increasing demands of #AI, etching techniques must deliver high levels of parallel processing, non-volatile memory, and fast data transfer rates. Gate-all-around transistors, 3D NAND memory, and high bandwidth memory are integral to AI’s future — learn more from Lam Research. https://bit.ly/3xa0AVF . #LifeAtLam

12

I Just attended TSMC 2024 Technology Symposium in Boston, MA, and it was an amazing and packed event! I learned so much about TSMC's platform solutions, including HPC, smartphone, IoT, and automotive. The advanced technology progress on 5nm, 4nm, 3nm, 2nm processes, and beyond was incredible. I also had the opportunity to meet with customers and discuss INNOSILICON's success in offering IPs/ASICs integration services from 65nm down to 3nm. We highlighted our offering platforms such as HPS, Automotive/ Infotainment, and Low-Power IoT. Customers will enjoy achieving the shortest Time-T-Market with optimum PPA, by engaging with INNOSILICON. It was great to run into industry icons such as Shameek Gupta, Roxann Broughton-Blanchard, Timothy Brug, Andreas Olofsson, Marek Hempel, Bobby Lu, Brian Amick, Jason Miller, and Micky H.. I also had the chance to discuss exciting ASIC integration services, as well as subsystem topics at INNOSILICON. Subsystems and connectivity IPs such as #HBM3E/4, #GDDR7/6X/6, #LPDDR 5X/5/4, #DDR5/4, #UCIe-based #Chiplet, #PCIe 5/4/3, 25G #Ethernet/Xaui, #USB 4/3/2, #eUSB, #MIPI C/D, #PVT Sensor, #HD Video, #ADC/DAC, #HDMI 2.1/eDP 1.4, #UFS/eMMC/ONFI, and #NOR Flash. #TSMC #INNOSILICON #semiconductor #ASIC #technology #IoT #automotive #HPC #event #Boston #platformsolutions #advancedtechnology #networking #subsystemtopics #innovation

50

5 Comments

Every single person on your team — no matter what their position is — should know and live by your company’s values. When I first joined Coherent Corp. (known as II-VI at the time) as a board member, we had 7 values. They were printed on the back of everyone’s business card but, still, I could never remember them all. In the wake of a large acquisition, I was walking around various facilities and chatting with everyone. I asked if anyone knew what our company’s values were — and no one knew them! That was a hint of an opportunity. I realized that the acquisition was a period of transformation for the company, and it was an opportunity to revisit our values. I remember studying the values of all the S&P 500 companies for inspiration, taking into consideration the founding values of II-VI as well as the values of the companies we had acquired. Eventually, I decided on: ICARE which stands for integrity, collaboration, accountability, respect and enthusiasm. Taken in that order, they have allowed our team to declare “I care” as the primary reason for working at Coherent and helping change the world. I firmly believe that values (and sticking to them) are integral to a company’s success. This might be a little bold to say but as far as I know, today, there’s no one in the company that doesn’t know what our values are.

356

24 Comments

We're expanding our edge computing portfolio with the new MCX W wireless MCU series. Dive into this article to learn how these advanced chips are powering smart industrial and IoT devices. #NXP #Semiconductors #IoT

8