Bob White

How to mitigate the effects of via impedance discontinuity 1. Incorporate coaxial via geometry To minimize via impedance discontinuity, you can opt for a coaxial via structure with a minimum of 2 and a maximum of 4 ground vias surrounding a signal via. 2. Keep the current return path as close as possible Place the ground via near the signal via.  This creates a low inductance loop between the signal via and the ground via ensuring an effective return path. The current can bypass the inductance loop even if there is an impedance mismatch in the via. Hence, the signal quality is maintained. -- Read the article to learn more. Send this post to PCB designers and engineers. #controlledimpedance #signalintegrity #pcbdesign

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My guy Shahrukh Patel is back for review number 2, this time with a very cool motor controller #pcb. We have very high number of leftover rules violations (531 to be exact!), but those can usually be solved by updating the default rule settings in Altium® Designer. Consider moving those motor driver ICs as well because those lines run close to your sensor interfaces. Want to have your design reviewed on the Altium Academy channel? Send me a message with your design files or your manufacturing files. https://lnkd.in/gnYda-Ds #electronicsengineering #pcbdesign #usb3

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What do you think of this #usb gateway from Duc. Chu? This was sent in for a 1-minute design review. When you route differential pairs on 2 layer boards, tight coupling and coplanar ground will be in full effect! Want to have your design reviewed on the Altium® Academy channel? Send me a message with your design files or your manufacturing files. https://lnkd.in/gfXn_n4M #electronicsengineering #pcbdesign #altiumdesigner

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Misconception #1 “I need a complex automatic transfer scheme at every voltage level” This may or may not be true, but in general if more than one automatic transfer scheme is present, the farther downstream it is, the less complex it has to be. For example, consider the system of Figure 1. As shown in Figure 1 below, two automatic transfer systems exist, one at the medium voltage level and one at the low voltage level. The automatic transfer system at the low voltage level must be coordinated so that it does not transfer unless the reason for transfer is not addressed by a transfer on the system at the medium voltage level.

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Episode 142 of the Reliability Matters Podcast is now available. This episode was recorded at the Surface Mount Technology Association (SMTA) Pan Pacific Strategic Electronics Symposium on the Big Island of Hawaii. My guests on this episode are Dr. Chuck Bauer, founder of PanPac, Keith Bryant, and Dr. Ron Lasky. We discussed the history of PanPac, technologies introduced at PanPac, and what makes PanPac so unique. We also discuss Dartmouth College's unique engineering innovations program. https://lnkd.in/gFW3j2HP #smta #panpac #reliabilitymatters #reliability

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What is an OhmegaPly material? OhmegaPly embedded thin-film resistor material is a thin layer of nickel phosphorous metal alloy (NiP) electrodeposited on copper foil. This is laminated to a dielectric material and subtractively processed to produce planar resistors. Due to its thin nature, it can be buried within layers without adding thickness or occupying space on the board like discrete resistors. Here, epoxies, polyimides, and PTFEs are all acceptable organic substrates. What is TCR material? TCR® is an integrated thin-film resistor foil (grade 3 copper foil) that is available in different foil widths and thicknesses. The commonly available thickness values are 18 µm (0.5 oz) and 35 µm (1 oz).  TCR ® foil is available in three different resistivity alloys: - Aluminum silicon, NCAS  - Chromium silicon monoxide, CrSiO - Nickel chromium, NiCr  -- Read the article to learn more. -- Share this with PCB designers and hardware engineers. #substrates #pcbmanufacturing #pcbdesign

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Since the subject of this article is somewhat not-that-easy to understand, I suggest starting with the basics of the synchronous motor. In the synchronous motor, the basic magnetic field is obtained by direct current excitation rather than through the air gap from the armature, as is the case with induction motors.

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Feeling "semiconductored?" Kevin Parmenter relates — and has a thing or two to say about it. Check out his op-ed on EE World Online today. Taiwan Semiconductor Martin Rowe Bill Schweber Jeff Shepard Rakesh Kumar, Ph.D. Aharon Etengoff Emma Lutjen Greg Evans #discretesemiconductors #componentshortages #supplychainresilience #alternativedesigns #discretecircuits #ICchortages #designengineering #electronicsmanufacturing #supplychainshallenges #futureproofdesigns

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Transient analysis for non-sinusoidal signals Transient analysis is one of the critical aspects to ensure signal integrity in your PCB design. The main goal is to figure out how a circuit reacts to the variations of driving voltage/current. Non-sinusoidal sources are used prominently in the world of electronics today. Transient analysis of circuits with such sources is an important prerequisite for designing an efficient high-speed circuit board. -- Read the article and learn the steps to perform transient analysis using a conventional method and simulation tools. #TransientAnalysis #PCBDesign #SignalIntegrity #CircuitDesign

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#Currentsensing in #powerelectronics refers to a set of techniques for measuring #electric currents with sufficient accuracy. Precise current sensing is of paramount importance in #powerconverters for implementing protection and control and ensuring #reliability. Wide-bandgap power converters make it hard to develop a single current-sensing scheme due to their inherent limited space and size, the required high-detection speed and the high electromagnetic-interference (EMI) emissions caused. #widebandgap #GaN #SiC An article published in July 2023 by Ali Parsa Sirat and Babak Parkhideh of the University of North Carolina at Charlotte highlights the main challenges with integrating current sensing into WBG #power converters. Different tradeoffs in matching all requirements make it difficult to implement one method of current sensing that applies to all cases. The authors explored methods to improve the performance of existing single-scheme current sensors. #powerelectronics

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If you work in electronics and you're not thinking about systems design, your perspective is probably too narrow. Check out this episode, and the entire series at "On The Line With..."

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5 PCB trace termination techniques to reduce signal reflections 1. Series trace termination 2. Parallel/shunt termination 3. Thevenin's trace termination 4. AC PCB trace termination 5. Bidirectional termination Article highlights --> Appropriately terminating traces ensures consistent impedance, minimizing signal distortion at the transmitter and the receiver end. --> Series termination involves placing a resistor in series close to the source to match the driver's impedance with the line impedance. --> Parallel/shunt termination involves placing a termination resistor in parallel with the receiver at the load end, providing a low-impedance path for reflected signals. --> Calculating the reflection coefficient helps predict the severity of signal reflections. Read the article for more. #signalintegrity #pcblayoutdesign #electricalengineering

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10 high-speed #PCBlayout design rules 1. Have a common ground plane right below the signal traces 2. Ensure adequate spacing between vias to avoid hotspots 3. Place vias symmetrically to eliminate impedance discontinuities 4. Maintain minimum bends while routing 5. Add serpentines to length match the traces 6. Maintain at least 3W spacing between the signal traces to minimize crosstalk 7. Implement daisy chain routing to avoid long stubs 8. Do not place components and vias between differential pairs 9. Design differential pairs with symmetrical paths and keep signals in parallel 10. Route differential signals on the same layer -- Read the article for more. -- Share this post with PCB designers and engineers. #ElectronicsDesign #SignalIntegrity #ElectricalEngineering

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Don't miss out on our new major design guide release with the PCB Stack-Up Design Guide! Stack-up design significantly impacts PCB factors such as signal integrity, power distribution, and thermal management. It provides the mechanical support necessary to withstand physical stresses and environmental factors. A well-designed signal-to-ground plane arrangement minimizes cross-talk and signal distortions. See what’s inside and download: - Design guidelines for HDI, flex, and hybrid stack-ups - Stack-up representation in fab drawing - DFM checks for layer stacks - Manufacturing tolerances - Inspection methods - PCB stack-up examples with illustrations https://lnkd.in/gFUSamY3 #pcb #pcbdesigner #pcbdesigning #pcbmanufacturer

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A Digital Signal Processor is a microcomputer that processes digital data representing analog signals. This #element14Comunity course from Analog Devices covers the basics, including hardware components and how to code common filters: https://lnkd.in/gbezWu3f

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7 factors that impact RF PCB design 1. Impedance matching 2. Radio-frequency board materials 3. RF PCB stack-up 4. RF trace design 5. Design of ground planes 6. Via design 7. Power supply decoupling -- Read the article for PCB design tips. #RadioFrequency #Wireless #ElectricalEngineering

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Check out my new blog on using our #radhard #MCU to reconfigure #Space deployed #FPGA. Please reach out if you have interest and we can provide specific details on how to deploy

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