Micross Components

Micross Components

Semiconductor Manufacturing

Apopka, FL 10,581 followers

The Most Complete Provider of Advanced Microelectronic Services and Component, Die & Wafer Solutions!

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About us

Micross is the most complete provider of advanced microelectronic services and component, die and wafer solutions. With the broadest authorized access to die & wafer suppliers, and the most comprehensive advanced packaging, assembly, modification and test capabilities, Micross is uniquely positioned to provide unparalleled high-reliability solutions from bare die, to fully packaged devices, to complete program lifecycle sustainment. For more than 40 years, Micross has been a trusted source for the aerospace, defense, space, medical, energy, communications, and industrial markets. Micross is the leading global one-source, one-solution provider of Bare Die & Wafers, Advanced Interconnect Technology, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing and Hi-Rel Products to manufacturers and users of semiconductor devices. For more than 40 years, our extensive hi-reliability capabilities have served the global Aerospace & Defense, Space, Energy, Medical, Industrial and Fabless Semiconductor markets. Micross possesses the sourcing, packaging, assembly, engineering, test and logistics expertise needed to support an application throughout its entire program cycle. www.micross.com Micross' Advanced Test Facility, Silicon Turnkey Solutions (STS), located in Milpitas, CA is an industry-recognized collaborative partner that integrates design, engineering, manufacturing and qualification processes with operational expertise to provide leading edge technology and test services that enable customers to meet demanding time-to-market pressure, cost and technical challenges. Micross STS possesses more than 25 years of electronic test expertise.

Website
http://www.micross.com/
Industry
Semiconductor Manufacturing
Company size
501-1,000 employees
Headquarters
Apopka, FL
Type
Privately Held
Founded
1978
Specialties
Bare Die, Die & Wafer Processing, Component Modification, Custom Packaging, MIL-SPEC Connectors, PEM-Quals, Robotic Hot Solder Dipping, Custom Packaging, Chip Scale Packaging, Engineering & Analytical Services, Full Turnkey Test Services, CGA, Counterfeit Mitigation, Advanced Interconnect Technology, Wafer Level Packaging, Flip Chip/MCM, Electrical & Environmental Test, Lead Attach, Wafer Bumping, BGA Reballing, RF Testing, Assembly Services, Die Attach, SMD/5962 Hi-Rel Products, Hi-Rel Memory, COTS, Wafer Probe, Hi-rel Microelectronic Components, Column Attach, Device Characterization Testing, ASIC Design, MIL-STD-1553 Data Bus Couplers, Data Bus Products, High-Reliability Microelectronics, Hi-Rel Microelectronics, Hi-Rel Power Supplies, Hi-Rel Diodes, Diodes, Upscreening, ASIC, FPGA, Radiation Tolerant, Radiation Hardened, Rad-Hard, Space-Grade, MIL-PRF-19500, JAN, JANTX, JANS, Component Modification Services, Robotic Hot Solder Dip, MIL-PRF-38534, MIL-PRF-38535, DMEA Trusted Source, DLA Certified, ANSI/ESD S20.20, NADCAP, and JOSCAR Registered

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