How do advanced packaging technologies enable heterogeneous integration of SoC components?

2 2.5D and 3D packaging

Another advanced packaging technology for SoC is 2.5D and 3D packaging, which involves stacking chips horizontally or vertically using interposers or through-silicon vias (TSVs). Interposers are thin layers of silicon or organic material that act as bridges between chips, while TSVs are vertical electrical connections that pass through the chips. 2.5D and 3D packaging can increase the bandwidth, performance, and functionality of SoC, as well as reduce the latency, power consumption, and heat dissipation. 2.5D and 3D packaging can also enable heterogeneous integration of different types of chips, such as logic, memory, analog, and RF.

3 Chiplet-based packaging

A third advanced packaging technology for SoC is chiplet-based packaging, which involves dividing a large chip into smaller and modular units, called chiplets, that can be mixed and matched in a package. Chiplets can be fabricated using different process nodes, architectures, or materials, and can be connected using high-speed interfaces, such as die-to-die (D2D) or chip-to-chip (C2C) links. Chiplet-based packaging can reduce the cost, complexity, and risk of SoC design, as well as improve the scalability, flexibility, and customization of SoC solutions.

4 Embedded packaging

A fourth advanced packaging technology for SoC is embedded packaging, which involves embedding chips or devices into substrates, such as printed circuit boards (PCBs) or molded interconnect devices (MIDs). Embedded packaging can reduce the thickness, weight, and parasitics of packages, as well as enhance the reliability, robustness, and integration of SoC. Embedded packaging can also enable heterogeneous integration of passive components, such as capacitors, resistors, or inductors, or active components, such as antennas, sensors, or LEDs.

5 Hybrid bonding

A fifth advanced packaging technology for SoC is hybrid bonding, which involves bonding chips or devices using both metal and dielectric layers, rather than solder or glue. Hybrid bonding can create finer pitch and higher density of interconnections, as well as lower resistance and capacitance of contacts. Hybrid bonding can also enable heterogeneous integration of different types of chips or devices, such as silicon, germanium, gallium arsenide, or silicon carbide.

6 Future trends

The demand for System on Chip (SoC) is expected to increase in various domains, such as artificial intelligence, edge computing, 5G, automotive, and biomedical. To satisfy this demand, advanced packaging technologies will be essential in enabling heterogeneous integration of SoC components, while also improving the performance, functionality, and reliability of SoC solutions. In the future, advanced packaging technologies will involve co-design and co-optimization of chips and packages, development of new materials and processes for packaging, integration of novel devices such as memristors, neuromorphic chips or quantum dots, adoption of standards and protocols for chiplet-based packaging, and exploration of new architectures and topologies for 2.5D and 3D packaging.