What are the proper techniques for using a hot air rework station for soldering and desoldering?
A hot air rework station is a tool that allows you to solder and desolder electronic components on a circuit board using a stream of hot air. It is especially useful for working with surface mount devices (SMDs) that have multiple pins or are very small. However, using a hot air rework station requires some proper techniques to avoid damaging the components or the board. In this article, you will learn how to prepare, perform, and clean up your soldering and desoldering tasks with a hot air rework station.
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Shantanusinh ParmarIon Propulsion engineer @ Infinity Space | Founder @EcliptaForge| Matching Membership Fellow @American Physical Society
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Dianabasi UkpongResults-Driven Business Development & Tender Manager | Streamlining Success with Strategic Insights and Dynamic…
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Abdul-Aal KllawyFood processing & Bakery machinery
The first step is to choose the right nozzle for your hot air rework station. The nozzle should match the size and shape of the component you want to solder or desolder, and it should direct the hot air evenly and precisely. A too large or too small nozzle can cause overheating, solder bridges, or cold joints. A too wide or too narrow nozzle can affect the surrounding components or the board. You can find different types of nozzles, such as round, square, or bent, for different purposes.
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Shantanusinh Parmar
Ion Propulsion engineer @ Infinity Space | Founder @EcliptaForge| Matching Membership Fellow @American Physical Society
Picking a sodlering iron of the right size is very important, the quality of the soldered joint depends indefinetly on it. The perfect nozzle size would just about cover over half of the portion you want to solder, giving you enough wiggle-room.
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Dianabasi Ukpong
Results-Driven Business Development & Tender Manager | Streamlining Success with Strategic Insights and Dynamic Relationship Building
Using a hot air rework station for soldering and desoldering electronic components involves careful preparation and technique. For soldering, select the appropriate temperature and airflow, apply flux, and use a sweeping motion to evenly heat the area. When desoldering, apply hot air to melt the solder, gently lift the component, and clean the pads. Practice scrap PCBs, control temperatures, maintain a proper nozzle distance and protect sensitive components. Always follow manufacturer guidelines and recommended practices for specific components.
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Abdul-Aal Kllawy
Food processing & Bakery machinery
Selecting the appropriate nozzle is crucial for efficient hot air rework. Consider the size and shape of the component you're working on, ensuring the chosen nozzle aligns with these specifications. Opt for a nozzle that directs hot air evenly and precisely to avoid overheating, solder bridges, or cold joints. Using a nozzle that is too large or small may result in adverse effects. Additionally, choose the right type of nozzle, be it round, square, or bent, based on the specific task at hand. Each type serves different purposes, so understanding the requirements of your project is essential for successful soldering or desoldering without negatively impacting surrounding components or the circuit board.
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𝐀𝐑𝐈𝐍𝐃𝐀𝐌 𝐃𝐀𝐒
𝑨𝒔𝒔𝒐𝒄𝒊𝒂𝒕𝒆 𝒂𝒕 𝑷𝒘𝑪 𝑰𝒏𝒅𝒊𝒂 || M.Tech Indian Institute of Engineering Science and Technology (IIEST), Shibpur || Switched Mode Power Converters || Digital control in SMPC ||
There are many types of hot air guns where we can have many interchangeable nozzles. We need to take into account the functions and features of our project then to decide the right choice for us. We need to consider the materials used in the project, how much sensitive the components are. Mostly while building circuits a thinner type of reduction nozzles are used which gives a thinner jet of air for soft soldering. The tiny nozzles are really helpful in focusing the airflow over a small chip. Whereas the bigger nozzles are helpful for applications in a big area like huge heat pad sinks.
The next step is to set the temperature and airflow of your hot air rework station. The temperature and airflow depend on the type and size of the component, the solder alloy, and the board material. You can consult the datasheets of the component and the solder for the recommended temperature range. Generally, you want to use the lowest possible temperature that can melt the solder without burning the component or the board. The airflow should be strong enough to blow away the molten solder, but not too strong to blow away the component or damage the board. You can adjust the temperature and airflow knobs or buttons on your hot air rework station.
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Abdul-Aal Kllawy
Food processing & Bakery machinery
To ensure precise soldering or desoldering, configuring the temperature and airflow of your hot air rework station is crucial. Refer to the datasheets of the component and solder alloy for recommended temperature ranges. Opt for the lowest temperature capable of melting solder without causing damage to the component or board. Adjust the airflow to a level sufficient for removing molten solder but avoid excessive strength that might displace components or harm the board. Use the temperature and airflow controls on your rework station, adjusting knobs or buttons to achieve the optimal settings based on the specific type and size of the component, solder alloy, and board material in use.
To solder the component, you need to apply some flux to the pads on the board where you want to place the component. Flux is a substance that helps the solder flow and adhere to the pads, and it also prevents oxidation and corrosion. You can use a flux pen, a syringe, or a brush to apply the flux. Then, you need to align the component with the pads using tweezers or a vacuum pick-up tool. You can also add some solder paste to the pads or the component pins if needed. Solder paste is a mixture of solder and flux that melts when heated. Next, you need to hold the hot air nozzle above the component at a safe distance and angle, and move it slowly and evenly until the solder paste melts and forms a solid joint. You can check the joint quality by looking for a shiny and smooth appearance, and by gently tapping the component with the tweezers.
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Abdul-Aal Kllawy
Food processing & Bakery machinery
To solder the component, start by applying flux to the board pads using a flux pen, syringe, or brush. Flux aids solder flow, adhesion, and prevents oxidation. Align the component with tweezers or a vacuum pick-up tool. Optionally, use solder paste on pads or component pins. Solder paste, a mix of solder and flux, melts when heated. Hold the hot air nozzle above the component at a safe distance, moving it slowly until solder paste forms a solid joint. Ensure a shiny, smooth appearance and check joint quality by gently tapping the component with tweezers. This method ensures proper soldering with minimal risk of overheating or damaging the component.
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𝐀𝐑𝐈𝐍𝐃𝐀𝐌 𝐃𝐀𝐒
𝑨𝒔𝒔𝒐𝒄𝒊𝒂𝒕𝒆 𝒂𝒕 𝑷𝒘𝑪 𝑰𝒏𝒅𝒊𝒂 || M.Tech Indian Institute of Engineering Science and Technology (IIEST), Shibpur || Switched Mode Power Converters || Digital control in SMPC ||
Choose an appropriate area to work and use some kind of platform like a table or non-metallic thing below which can absorb heat so that we can touch it while removing setup if necessary. At first apply the solder glue to the points/nodes where elements will be connected. Then choose the correct nozzle type in the air gun. Keep tweezers ready in your hands ready for use. Turn on the airgun and start blowing over the area the glue will spread at first. After sometime the solder joints will start melting and a they will give a shiny look that's when we can confirm that the soldering is done correctly.
To desolder the component, you need to apply some flux to the solder joints that connect the component to the board. Then, you need to hold the hot air nozzle above the component at a safe distance and angle, and move it slowly and evenly until the solder melts and becomes liquid. You can use tweezers or a vacuum pick-up tool to lift the component from the board while the solder is still molten. You can also use some solder wick or a solder sucker to remove the excess solder from the pads or the component pins. Solder wick is a braided copper wire that absorbs the solder when heated. A solder sucker is a device that creates a vacuum to suck the solder when triggered.
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𝐀𝐑𝐈𝐍𝐃𝐀𝐌 𝐃𝐀𝐒
𝑨𝒔𝒔𝒐𝒄𝒊𝒂𝒕𝒆 𝒂𝒕 𝑷𝒘𝑪 𝑰𝒏𝒅𝒊𝒂 || M.Tech Indian Institute of Engineering Science and Technology (IIEST), Shibpur || Switched Mode Power Converters || Digital control in SMPC ||
While desoldering any component we need to blow the hot air gun over the area of the elements' joints. Keep a safe distance from it and protect your eyes. A spectacle glass can be used while soldering or desoldering to protect our eyes while doing this kinds of work. After hovering over the joints and melting take out the element using tweezers or vacuum pick-up tool to take out the element. A solder suck will be required for cleaning up the excess solder from the area. This solder suck can even be a simple vacuum type solder gun also.
The final step is to clean up the board after soldering or desoldering. You need to remove any flux residue, solder splashes, or dirt from the board using a cotton swab and some isopropyl alcohol. You can also use a soft brush or compressed air to remove any dust or debris. You should inspect the board for any damage, such as burns, cracks, or lifted pads, and repair them if possible. You should also test the board for any short circuits, open circuits, or faulty components using a multimeter or an oscilloscope.
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