Abstract
The methods for modeling the thermodynamic properties of multicomponent systems are described in this article. The rules for creating a consistent database for muticomponent systems are described in general terms and documented in relation to the thermodynamic database for lead-free solders, developed within the scope of European Cooperation in the Field of Scientific and Technical Research Action 531. New assessments and reassessments of the Bi-Sn-Zn, Cu-Ni-Sn, and Ag-Cu-Sn systems are shown as examples illustrating the application of the database for the modeling of lead-free solder materials.
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References
COST531 homepage: www.univie.ac.at/cost531/.
R.H. Davies et al., CALPHAD, 26 (2002), p. 229.
S.-L. Chen et al., CALPHAD, 26 (2002), p. 175.
J.-O. Andersson et al., CALPHAD, 26 (2002), p. 273.
C.W. Bale et al., CALPHAD, 26 (2002), p. 189.
N. Saunders and A.P. Miodownik, CALPHAD (A Comprehensive Guide) (London: Elsevier, 1998).
R. Schmid-Fetzer et al., CALPHAD, 31 (2007), p. 38.
A.T. Dinsdale, CALPHAD, 15 (1991), p. 317.
SGTE Unary database, Version 4.4 (Teddington, U. K.: Scientific Group Thermodata Europe, 2001).
V.D. Malakhov et al., J. Phase Equilib., 21 (2000), p. 514.
M.H. Braga et al., CALPHAD (in print 2007).
J. Vízdal et al., CALPHAD (in print, 2007).
N. Asryan and A. Mikula, Z. Metallkd., 95 (2004), p. 132.
X.J. Liu et al., J. Electron. Mater., 9 (2001), p. 1093.
H.S. Liu, J. Wang, and Z.P. Jin, CALPHAD, 28 (2004), p. 363.
J. Miettinen, CALPHAD, 27 (2003), p. 309.
K.W. Moon et al., J. Electron. Mater., 29 (2002), p. 1122.
M.E. Loomans and M.E. Fine, Met. Mat. Trans. A, 31A (2000), p. 1155.
Y.-W. Yen, and S.-W. Chen, J. Mater. Res., 19 (2004), p. 2298.
R.E. Gebhardt and G. Petzow, Z. Metallade, 50 (1959), p. 597.
V.N. Fedorov, O.E. Osinchev, and E.T. Yushkina, Phase Diagrams of Metallic Systems, vol. 26, ed. N.V. Ageev and L.A. Petrova (1982), p. 149.
C.M. Miller, I.E. Anderson, and J.F. Smith, J. Electron. Mater., 23 (1994), p. 595.
S. Chada et al., J. Electron. Mater., 26 (1999), p. 1194.
S.W. Chen and Ch.A. Chang, J. Electron. Mater., 33 (2004), p. 1071.
S.S. Shen, P.J. Spencer, and M.J. Pool, Trans. AIME, 245 (1969), p. 603.
C. Luef, H. Flandorfer, and H. Ipser, Z. Metallkd., 95 (2004), p. 151.
B.J. Lee, N.M. Hwang, and H.M. Lee, Acta Mater., 45 (1997), p. 1867.
H.M. Lee, S.W. Yoon, and B.J. Lee, J. Electron. Mater., 27 (1998), p. 1161.
I. Ohnuma et al., J. Electron. Mater., 29 (2000), p. 1137.
J.A. Gisby and A.T. Dinsdale, unpublished work (2002).
A.T. Dinsdale and A. Watson, unpublished work (2007).
L. Zabdyr, unpublished work (2005).
C. Hunt et al., “Predicting Microstructure of Mixed Solder Alloy Systems,” NPL Report, MATC(A), 83 (2002).
Z. Huang et al., J. Electron. Mater., 33 (2004), p. 1227.
T. Tanaka, K. Hack, and S. Hara, MRS Bulletin, 24(4) (1999), p. 45.
J.A.V. Butler, Proc. Roy. Soc. London, 85 (1932), p. 347.
I. Ohnuma et al., J. Phase Equil. Diffusion, 27(3) (2006), p. 245.
R. Picha, J. Vrestal, and A. Kroupa, CALPHAD, 28 (2004), p. 141.
SURDAT Database of Lead-Free Soldering Materials (Krakow, Poland: Institute of Metallurgy and Materials Science of the Polish Academy of Sciences, 2007), www.imim.pl/index.php?id=215.
H. Ohtani and K. Ishida, J. Electron. Mater., 23 (1994), p. 747.
W. Oelsen and K.F. Golücke, Arch. Eisenhüttenw., 29 (1958), p. 689.
S. Nagasaki and E. Fujita, J. Jpn. Inst. Met., 16 (1952), p. 317.
S.D. Muzaffar, J. Chem. Soc., 123 (1923), p. 2341.
T. Heumann, Z. Metallkd., 35 (1943), p. 211.
W. Mikula, L. Thomassen, and C. Upthegrove, Trans. AIME, 124 (1937), p. 111.
M.J. Pool et al., Z. Metallkde., 70 (1979), p. 656.
J. Veszelka, Mitt. Berg-Hüttemänn (Sopron, Hungary: Abt. Ung. Hochschule Berg-Forstw., 1932).
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Kroupa, A., Dinsdale, A.T., Watson, A. et al. The development of the COST 531 lead-free solders thermodynamic database. JOM 59, 20–25 (2007). https://doi.org/10.1007/s11837-007-0084-6
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DOI: https://doi.org/10.1007/s11837-007-0084-6