Abstract
Printed circuit board (PCB) recycling is an important challenge for today’s industry. This paper presents results from a study of cryogenic decomposition as a potential alternative recycling method for obsolete printed circuit board scraps. In this method liquid nitrogen is employed as a cryogen to form an environment as low as 77 K for PCB treatment. In order to test the effect of thermal stress set-up during the rapid cryogenic treatment, impact tests were used to simulate the current shredding process. The treated PCB scraps were investigated under a monocular microscope with a 200X magnitude for micro-crack effect observation. Fatigue behavior of the boards was also examined by repeating the cryogenic treatment. The experimental results, as analyzed, demonstrated no obvious support to this alternative PCB recycling method. The energy absorbed during the impact tests for the cryogenically treated boards is insignificantly different from those without the treatment.
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Taberman SO, Carlsson B, Erichson H, Brobech J, Gregersen JC (1995) Environmental consequences of incineration and landfilling of waste from electr(on)ic equipment. temaNord report to the nordic council of ministers, Copenhagen
Goosey M, Kellner R (2001) A scoping study end-of-life printed circuit boards. Department of Trade and Industry, Intellect & Shipley Europe Limited
Stanford Resources Inc. (1999) Electronic product recovery and recycling baseline report: recycling of selected electronic products in the United States. National Safety Council, Washington, DC
ENEA (1995) Priority waste streams: waste from electrical and electronic equipment, information document. Italian National Agency for New Technology, Energy and the Environment (ENEA)
Wilkinson S, Duffy N, Crowe M (2001) Waste from electrical and electronic equipment in Ireland: a status report. EPA topic report
Mayes J, Nickerson S, Welsh J (2004) A multiscale approach to the effects of cryogenic environments on polymer matrix composites. AIAA-2004-1934, 45thAIAA/ASME/ASCE/AHS/ASC structures, structural dynamics and materials conference, Palm Springs, CA
Hartwig G (1994) Polymer properties at room and cryogenic temperatures. Plenum, New York
Takeda T, Shindo Y, Narita F (2004) The thermo-mechanical problem of internal and edge cracks in multi-layered woven GFRP laminates at cryogenic temperatures. American Institute of Physics proceedings 711(1):248–258
Timmerman JF, Hayes BS, Seferis JC (2003) Cryogenic microcracking of carbon fiber/epoxy composites: influences of fiber-matrix adhesion. J Compos Mater 37(21):1939–1950
Kuchnir M (1999) Mechanical and thermal properties of structural materials. In: Chao AW andTigner M (eds) Handbook of accelerator physics and engineering. WorldScientific, New Jersey
Yen C, Caulfield T, TienJK, Roth LD, Wells JM (1983) Cryogenic creep of copper. Metals/materials technology series, Philadelphia
Steven W, Sciver V (1986) Helium cryogenics. Plenum, New York
Schwartzberg FR et al (1964) Cryogenic materials data handbook. Martin company, Denver
Material Property Database. Temperature dependent elastic and thermal properties database.http://www.jahm.com/index.html. Accessed on 3/28/2006
Plastics Portal Europe. Properties of polystyrene.https://www.plasticsportal.net/wa/EU/Catalog/ePlastics/doc/BASF/prodline/polystyrol/properties.xdoc#N10040. Accesed on 3/28/2006
Gwilym E, Owen JR (1981) A comparison of impact tests for assessment of fiber glass reinforced plastic toughness. Polym Eng Sci21 (8):467–473
Tjong SC, Xu SA, Mai YW(2003) Impact fracture toughness of short glass fiber-reinforced polyamide 6, 6 hybrid composites containing elastomer particles using essential work of fracture concept. Mater Sci Eng: A 347(1):338–345
Clemons CM, Giacomin AJ, Koutsky JA (2004) Dynamic fracture toughness of polypropylene reinforced with cellulose fiber. Polym Eng Sci 37(6):1012–1018
Ting RY, Cottington RL. Comparison of laboratory techniques for evaluating the fracture toughness of glassy polymers. J Appl Polym Sci 25(9):1815–1823
Plastics Technology Laboratories. Izod Impact Testing (Unnotched Izod).http://www.ptli.com/testlopedia/tests/izod-d4812.asp.Accessed on 03/31/2006
Acknowledgements
We gratefully acknowledge thefinancial support from National Science Foundation (project #: DMII 0225927)and the College of Engineering at Texas Tech University.
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Yuan, C.Y., Zhang, H.C., McKenna, G. et al. Experimental studies on cryogenic recycling of printed circuit board. Int J Adv Manuf Technol 34, 657–666 (2007). https://doi.org/10.1007/s00170-006-0634-z
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DOI: https://doi.org/10.1007/s00170-006-0634-z