US Opens $1.6 Billion Competition for Chip Packaging Research
- Projects to win up to $150 million across five research areas
- Funding opportunity is the largest yet from Chips Act R&D fund
A wafer sorter at semiconductor manufacturing facility. The announcement represents by far the largest funding opportunity to come out of an $11 billion Chips Act R&D fund.
Photographer: Cindy Schultz/BloombergThe Biden administration is launching a $1.6 billion funding competition for chip packaging research and development projects, marking the latest attempt to revitalize the domestic semiconductor industry.
The funding — coming from the 2022 Chips and Science Act — will pay for research in five areas, said Commerce Undersecretary for Standards and Technology Laurie E. Locascio. In addition to backing research, officials expect to help finance prototype development.